Semiconductor Package Lid Cavity Structure for Compact Reliable Assembly
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Solution Overview
Problem
Existing semiconductor packages face issues such as excess cost, decreased reliability, relatively low performance, and large package sizes, which are not adequately addressed by conventional methods.
Innovation Solution
The proposed semiconductor device and manufacturing method involve a substrate with a sidewall, an electronic component attached adjacent to the sidewall, an encapsulant covering the interconnects, and a lid attached using a lid attach material, creating a cavity that enhances protection and electrical coupling while optimizing package size and performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional semiconductor packaging methods are used, then manufacturing simplicity is maintained, but package size becomes too large and cost increases
Solution Approach 1:
The patent transitions from conventional planar packaging to a three-dimensional structure by forming a cavity within the package body. The cavity is created by defining a volume within the encapsulant material, allowing components to be positioned in three-dimensional space rather than only on a two-dimensional plane. This dimensional change enables compact packaging while maintaining manufacturing feasibility through standard encapsulation processes.
2Reliability
If conventional packaging structures are used, then manufacturing process simplicity is maintained, but reliability decreases
Solution Approach 1:
The package structure is segmented into distinct functional regions: a body portion containing the cavity, an encapsulant material filling the cavity, and a lid sealing the cavity. This segmentation allows each component to be optimized independently for its specific function while maintaining overall structural integrity. The encapsulant material can be selected specifically for protective properties, while the lid provides sealing functionality, thereby improving reliability without requiring complex integrated structures.
3Reliability
If conventional packaging is used, then manufacturing simplicity is maintained, but performance is relatively low
Solution Approach 1:
The encapsulant material serves multiple functions simultaneously: it fills the cavity to provide structural support, protects internal components from environmental damage, and enables thermal management by conducting heat away from sensitive components. This multi-functionality improves overall package performance without adding separate dedicated structures for each function, thereby avoiding excessive complexity.
4Ease of manufacture
If conventional packaging methods are used, then manufacturing simplicity is maintained, but cost increases
Solution Approach 1:
The patent optimizes material usage by carefully controlling the volume and shape parameters of the cavity. The cavity is designed with specific dimensional relationships to the package body, allowing minimum necessary material usage while maintaining protective functionality. By adjusting cavity parameters such as depth, width, and positioning, the design achieves cost-effective material consumption without compromising manufacturing simplicity or protective performance.
Data Source
AI summary
In one example, an electronic device can comprise a substrate, a substrate sidewall over a side of the substrate. An electronic device can be disposed over the side of substrate and adjacent the substrate sidewall. An internal interconnect can be disposed between the electronic device and the substrate sidewall. An encapsulant can cover the internal interconnect between the electronic device and the substrate sidewall. A lid attach material can be disposed over the substrate sidewall and the encapsulant. A lid can be coupled to the encapsulant and the substrate sidewall by the lid attach material. A cavity can be defined between a bottom side of the lid and a top side of the electronic device. Other examples and related methods are also disclosed herein.