Semiconductor Package Light Absorbing Layer for Noise Reduction
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Solution Overview
Problem
As semiconductor package structures shrink, thinner semiconductor dies allow light to pass through, causing noise that affects performance, necessitating a new structure to address this issue.
Innovation Solution
A semiconductor package structure with a light absorbing layer covering the backside and side surfaces of the die, featuring varying thicknesses to effectively absorb light and reduce noise, while maintaining a smaller size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the thickness of the semiconductor die is reduced to decrease package size, then the device size is reduced, but light passes through the die causing noise that affects performance
Solution Approach 1:
A light absorbing layer is introduced as an intermediary substance between the semiconductor die and the external environment. This layer specifically targets and absorbs incident light before it can pass through the thin semiconductor die and cause noise in the active layer, thereby resolving the contradiction between reduced die thickness and light noise prevention
Solution Approach 2:
The invention converts the harmful effect of light (which causes noise when passing through the die) into a beneficial effect by using the light absorbing layer to capture and dissipate the light energy. The light that would otherwise be harmful is now absorbed and converted into harmless thermal energy or other non-interfering forms
2Object-affected harmful factors
If a light absorbing layer is added to block light, then light noise is reduced, but the device complexity increases
Solution Approach 1:
The light absorbing layer serves multiple functions simultaneously: it absorbs incident light to prevent noise, provides a reflective surface to direct light away from the active layer, and can be integrated into existing package structures. This multi-functionality reduces the need for additional separate components, thereby limiting the increase in device complexity
Solution Approach 2:
The light absorbing layer is merged with the semiconductor die structure, forming an integrated component where the light absorbing properties are combined with the mechanical and electrical functions of the die. This integration approach minimizes the increase in overall device complexity by combining multiple functions into a single unified structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The light absorbing layer significantly reduces noise signals by absorbing over 99% of incident light, enhancing the reliability and performance of the semiconductor package structure without increasing its size.
Implementation Method 1
a light absorbing layer covers the second surface and the third surface of the semiconductor die
Data Source
AI summary
A semiconductor package structure and a method for manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a semiconductor package structure includes a semiconductor die and a light absorbing layer. The semiconductor die has a first surface, a second surface and a third surface. An active layer of the semiconductor die is adjacent to the first surface. The second surface is opposite to the first surface. The third surface extends from the first surface to the second surface. The light absorbing layer covers the second surface and the third surface of the semiconductor die. The semiconductor die has a thickness defined from the first surface to the second surface, and the thickness of the semiconductor die is less than or equal to about 300 micrometers (μm).