Semiconductor Package Light Cross-Talk Prevention
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Solution Overview
Problem
Existing ECG detecting devices with both optical and electrical components face challenges in precision and accuracy due to increased size and manufacturing complexity, as well as malfunctions caused by light cross-talk through over-bleeding transparent molding compounds.
Innovation Solution
A semiconductor package device with a substrate, light emitter, light detector, and transparent conductive film, where a light block element is embedded within the substrate between the light emitter and detector, and an opaque layer is used to prevent immediate light transmission, allowing for accurate ECG signal measurement without additional substrate layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a conductive cover and additional substrate layers are added to prevent light cross-talk, then light blocking effectiveness is improved, but device size and manufacturing complexity increase
Solution Approach 1:
The patent extracts the light-blocking function from separate substrate layers and conductive covers, and integrates it into the transparent molding compound itself by adding light-absorbing particles. This eliminates the need for additional substrate layers while maintaining effective light cross-talk prevention.
Solution Approach 2:
The patent merges multiple functions into the transparent molding compound: structural encapsulation, electrical insulation, and light blocking. By incorporating light-absorbing particles into the molding compound, it simultaneously achieves transparency for necessary light transmission and opacity for blocking cross-talk, eliminating the need for separate light-blocking layers.
2Object-affected harmful factors
If a light block wall is disposed on the substrate between light emitter and detector, then light cross-talk is prevented, but light leakage through over-bleeding molding compound occurs
Solution Approach 1:
The patent changes the optical parameters of the molding compound by incorporating light-absorbing particles. This modifies the compound's light transmission properties to prevent over-bleeding and light leakage, ensuring that light blocked by the light block wall does not leak through the molding compound, thereby maintaining detection accuracy.
3Measurement precision
If both optical and electrical detecting components are integrated on the substrate, then ECG measurement precision is improved, but overall device size increases
Solution Approach 1:
The patent makes the transparent molding compound multi-functional by incorporating light-absorbing particles, enabling it to simultaneously provide structural support, electrical insulation, and light blocking. This eliminates the need for separate dedicated light-blocking components, reducing overall device area while maintaining the integrated optical and electrical detecting capabilities for precise ECG measurement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the overall size and manufacturing cost of the device, prevents light cross-talk, and enables accurate simultaneous optical and electrical ECG signal detection using a single hand, enhancing measurement precision and user convenience.
Implementation Method 1
emitting a light passing through the substrate to reach the first portion of a body by a light emitter
Implementation Method 2
detecting the light reflected from the first portion of the body by a light detector
Implementation Method 3
A transparent conducting film is disposed on the second surface of the substrate
Implementation Method 4
The substrate is configured to transmit light
Data Source
AI summary
A semiconductor package device comprises a substrate, a light emitter, a light detector and a transparent conductive film. The substrate as a first surface and a second surface opposite to the first surface. The light emitter is disposed on the first surface of the substrate and has a light emission area adjacent to the first surface of the substrate. The light detector is disposed on the first surface of the substrate and has a light receiving area adjacent to the first surface of the substrate. The transparent conducting film is disposed on the second surface of the substrate.