Semiconductor Package Structure for Heat Dissipation and Light Diffusion
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Solution Overview
Problem
Semiconductor device packages face challenges in achieving efficient heat dissipation, mechanical stability, and preventing strong light from directly incident on humans while maintaining a small size and high-power light output.
Innovation Solution
A semiconductor element package design featuring a substrate with high thermal conductivity, a housing with a diffusion part, and a protective layer to prevent moisture and external impacts, along with a detection circuit to ensure the diffusion part remains securely attached, preventing direct light exposure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If the semiconductor device is designed for high power and high voltage drive, then the light output is improved, but the temperature of the package is raised due to heat generation
Solution Approach 1:
The patent extracts the harmful heat away from the semiconductor element by introducing a through-hole filled with heat dissipation material that extends from the upper surface to the lower surface of the package. This creates a direct thermal conduction path that removes heat from the element, allowing high power operation without excessive temperature rise.
Solution Approach 2:
The patent introduces a heat dissipation material as an intermediary substance filled in the through-hole. This material acts as a thermal conductor between the semiconductor element and the external environment, facilitating efficient heat transfer while allowing the element to maintain high power output.
2Volume of moving object
If the package size is reduced for miniaturization, then the product size is decreased, but the heat dissipation efficiency is reduced
Solution Approach 1:
The patent applies local quality by concentrating heat dissipation functionality in a specific location (the through-hole region) rather than distributing it throughout the entire package. The heat dissipation material is placed precisely where thermal conduction is most effective, maintaining efficiency despite the small overall package volume.
Solution Approach 2:
The patent transitions from surface-level heat dissipation to three-dimensional heat management by creating a through-hole that penetrates the entire package thickness. This vertical dimension allows heat to be conducted directly from the element through the package substrate, achieving efficient dissipation in a compact footprint.
3Power
If strong light is emitted from the semiconductor device, then the light output is improved, but the risk of direct incident on human eyes increases
Solution Approach 1:
The patent introduces a diffuser as an intermediary optical element between the semiconductor element and the external environment. This diffuser scatters the strong light emitted by the element, reducing the intensity of direct beams while maintaining overall light output, thereby protecting human eyes from concentrated light exposure.
Solution Approach 2:
The patent utilizes optical property changes by incorporating a diffuser that modifies the light's spatial distribution and intensity profile. The diffuser changes the characteristics of the emitted light from a concentrated beam to a scattered pattern, reducing harmful direct exposure while preserving illumination effectiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides excellent heat dissipation, mechanical stability, and prevents strong light from directly incident on humans, ensuring safe operation and reliable performance.
Implementation Method 1
a plurality of via holes passing through the first substrate and the housing
Implementation Method 2
a diffusion part disposed on the step of the housing and disposed on the semiconductor element
Data Source
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AI summary
A semiconductor element package includes: a semiconductor element arranged above a first substrate; first and second electrodes arranged above the first substrate and electrically connected to the semiconductor element; a housing which is arranged above the first substrate and arranged around the semiconductor element, and which has a stepped portion in the upper area thereof; a diffusion part arranged on the stepped portion of the housing and arranged above the semiconductor element; and a plurality of via holes penetrating the first substrate and the housing.