Semiconductor Package Voltage Regulation With Direct Load Sensing
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Solution Overview
Problem
Existing semiconductor packages experience significant IR drop due to the need for additional through via structures to deliver power and stabilize voltage, which is inefficient and unsatisfactory.
Innovation Solution
Incorporating a voltage regulator on a first semiconductor die to directly sense and regulate power supply, eliminating the need for additional interconnect structures and reducing IR drop by directly sensing the signal level from the load.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If additional through via structures are used to deliver power and stabilize voltage, then power delivery capability is improved, but IR drop increases and device complexity increases
Solution Approach 1:
The voltage regulator and load circuit are merged onto the same first semiconductor die, allowing the voltage regulator to directly sense the voltage at the load without requiring additional through via structures. This integration eliminates the need for separate sensing paths and reduces the number of interconnect structures, thereby reducing IR drop while maintaining power delivery capability.
Solution Approach 2:
The patent introduces a sensing mechanism that directly monitors the voltage at the load circuit location. This sensing intermediary provides real-time feedback about the actual voltage conditions at the load, enabling the voltage regulator to adjust its output precisely without relying on multiple through via structures that would introduce additional resistance and IR drop.
2Stability of the object's composition
If additional through via structures are used to deliver power and stabilize voltage, then voltage stability is improved, but device complexity increases
Solution Approach 1:
The voltage regulator and load circuit are merged onto the same first semiconductor die, allowing the voltage regulator to directly sense the voltage at the load without requiring additional through via structures. This integration eliminates the need for separate sensing paths and reduces the number of interconnect structures, thereby reducing IR drop while maintaining power delivery capability.
Solution Approach 2:
The patent implements a feedback mechanism where the voltage regulator continuously monitors the voltage at the load circuit through direct sensing. This feedback loop allows the voltage regulator to dynamically adjust its output to maintain stable voltage levels at the load, eliminating the need for multiple through via structures that would otherwise be required for voltage stabilization.
3Loss of energy
If voltage regulator is integrated on the same die as load circuit, then IR drop is reduced, but integration density increases
Solution Approach 1:
The voltage regulator and load circuit are merged onto the same first semiconductor die, allowing the voltage regulator to directly sense the voltage at the load without requiring additional through via structures. This integration eliminates the need for separate sensing paths and reduces the number of interconnect structures, thereby reducing IR drop while maintaining power delivery capability.
Data Source
AI summary
A semiconductor package includes a first die comprising a voltage regulator that has a first input and a second input. The semiconductor package includes a second die coupled to the first die and comprising a first load circuit. The voltage regulator is configured to provide a regulated voltage to the first load circuit through a first through via structure based on a first voltage received through the first input and a second voltage received from the first load circuit through a second through via structure. The first voltage is a constant reference voltage, and the second voltage is a first signal sensed from the first load circuit.