Semiconductor Package Differential Line Layout for Low Crosstalk
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor packages face challenges in reducing crosstalk and signal loss, particularly in high-frequency radio-frequency signal transmission due to interference between signal lines, which affects the characteristic impedance and propagation characteristics.
Innovation Solution
The semiconductor package incorporates an insulating substrate with a first groove and ground planes, forming a stripline and coaxial structure, where the differential lines transition between these configurations, reducing radiation and maintaining appropriate impedance through strategic placement of ground conductors and connection conductors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-generated harmful factors
If signal lines are configured to carry differential signals with a notch in the insulating substrate, then crosstalk between signal lines is reduced, but signal insertion loss increases due to radiation from the discontinuous ground plane
Solution Approach 1:
The ground plane is segmented into two separate ground planes positioned on opposite sides of the stripline structure. This segmentation allows each ground plane to be continuous and maintain proper grounding, while still providing effective shielding for the differential signal lines, thereby reducing both crosstalk and signal radiation loss
Solution Approach 2:
The ground planes are positioned in different spatial dimensions (on opposite sides of the stripline structure) rather than being coplanar. This three-dimensional arrangement provides effective electromagnetic shielding and ground continuity without interfering with the differential signal transmission, resolving the contradiction between crosstalk reduction and signal loss prevention
2Loss of energy
If a continuous ground plane is used to reduce radiation, then signal insertion loss is reduced, but crosstalk between adjacent signal lines increases
Solution Approach 1:
The ground system is segmented into two separate ground planes positioned on opposite sides of the stripline structure. This segmentation enables each ground plane to provide continuous grounding and shielding independently, effectively reducing both radiation loss and crosstalk between adjacent signal lines
Solution Approach 2:
Each ground plane is locally optimized to provide specific functions: one ground plane provides shielding and grounding for signals on one side of the stripline structure, while the other ground plane provides the same function for signals on the opposite side. This local optimization allows simultaneous reduction of radiation and crosstalk
Data Source
AI summary
A semiconductor package includes an insulating substrate a pair of signal electrodes, a pair of differential lines, and a ground conductor. The pair of differential lines are respectively connected to the signal electrodes. Each differential line includes a first signal line, a second signal line, a first via-hole conductor, and a second via-hole conductor. The ground conductor includes a ground plane, a ground plane, and a ground via-hole conductor. The ground plane sandwiches the first signal line between the ground plane and the ground plane and forms a stripline structure. The ground via-hole conductor is located along the second via-hole conductor and forms a coaxial structure. In planar perspective view of the first surface, a position on a plane including the ground plane including the second end portion is located in a gap region.