Semiconductor Package Stacking for Low-Impedance Interconnects
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Solution Overview
Problem
Existing semiconductor package structures experience electrical losses due to intermediate substrates, redistribution structures, and solder balls, which increase impedance and reduce performance.
Innovation Solution
A semiconductor package structure is designed with a first semiconductor device having an active surface, a redistribution structure, and a second semiconductor device bonded between the first device and the redistribution structure, with conductive elements connecting them directly, reducing the transmission path and minimizing resistivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If intermediate substrates, redistribution structures, and solder balls are used for electrical connection, then device functionality and signal transmission are achieved, but electrical losses and impedance increase
Solution Approach 1:
The patent removes intermediate substrates, redistribution structures, and solder balls from the electrical connection path between semiconductor devices. By directly bonding devices together, it extracts the harmful intermediate elements that cause electrical losses while maintaining electrical connection functionality through direct die-to-die or die-to-substrate bonding interfaces.
Solution Approach 2:
The patent merges multiple separate components (semiconductor devices, substrates, redistribution structures, solder balls) into a more integrated configuration. By bonding devices directly to each other or to the substrate, it combines what were previously separate electrical connection elements into a unified, low-impedance pathway, reducing the number of interfaces and associated losses.
2Ease of manufacture
If intermediate substrates and redistribution structures are used, then electrical connection is established, but impedance increases and performance decreases
Solution Approach 1:
The patent extracts intermediate substrates and redistribution structures from the signal path, eliminating the impedance they introduce. By establishing direct bonding interfaces between devices and substrates, it removes the harmful impedance-generating elements while maintaining manufacturing feasibility through established direct bonding techniques.
3Adaptability or versatility
If more intermediate substrates and redistribution structures are added, then additional functions and signal transmission paths are achieved, but electrical losses increase
Solution Approach 1:
The patent transitions from a planar, multi-layer interconnection architecture to a vertical, three-dimensional stacked configuration. By stacking semiconductor devices directly on top of each other or on the substrate with direct bonding, it changes the spatial dimension of electrical connections, shortening current paths and reducing electrical losses while maintaining functional versatility through the stacked arrangement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly reduces electrical losses and impedance, enhancing the performance by shortening the powering path and alleviating parasitic effects.
Implementation Method 1
a plurality of conductive elements over the active surface of first semiconductor device and outside the second semiconductor device. The first semiconductor device is electrically connected to the redistribution structure via the conductive elements
Implementation Method 2
a second semiconductor device bonded to the active surface of the first semiconductor device and disposed between the first semiconductor device and the redistribution structure
Data Source
AI summary
A semiconductor package structure and a method of manufacturing the semiconductor package structure are disclosed. The semiconductor package structure includes a first semiconductor device having an active surface, a redistribution structure in electrical connection with the first semiconductor device, and a second semiconductor device bonded to the active surface of the first semiconductor device, and disposed between the first semiconductor device and the redistribution structure.