Semiconductor Package Layout With Through-Substrate Magnet Integration
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Solution Overview
Problem
Current semiconductor packages for smart watches lack integration of embedded sensor processing modules, compromising on compactness, power efficiency, and performance.
Innovation Solution
A semiconductor package design featuring a metal shim with a package substrate, electronic components, an encapsulant layer, connectors, and a magnet, where the encapsulant layer exposes the substrate's opening to accommodate a magnet extending through, enabling embedded sensor processing and improved connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If traditional semiconductor packages are used for smart watches, then the device can be assembled with conventional components, but the package size increases and integration of sensor processing modules is compromised
Solution Approach 1:
The patent combines multiple functional components (sensors, processing modules, connectors, and magnetic elements) into a single integrated semiconductor package. The package substrate integrates sensor elements with processing circuitry, while the metal shim provides both structural support and additional functional layers. This merging of functions into a unified package reduces the overall volume required while maintaining all necessary sensor processing capabilities.
Solution Approach 2:
The patent employs a nested structure where the magnet is positioned within an opening in the package substrate, the encapsulant layer surrounds and protects the electronic components, and the metal shim serves as the base layer with other components stacked or integrated upon it. This nested arrangement maximizes space utilization, allowing multiple functional elements to coexist in a compact configuration that reduces package volume while maintaining integration.
2Productivity
If more electronic components are integrated into the package, then sensor processing capability improves, but power consumption increases
Solution Approach 1:
The patent implements local quality by providing an encapsulant layer that selectively covers and protects only the electronic components requiring protection, while leaving the opening exposed for the magnet. The metal shim provides localized functional areas with different properties. This targeted approach allows integration of necessary processing components without unnecessarily increasing power consumption across the entire package, as only specific regions are activated and protected.
3Reliability
If the encapsulant layer covers the entire substrate, then protection of electronic components is maximized, but access to the opening and magnet mounting is blocked
Solution Approach 1:
The patent extracts or removes the encapsulant layer from the region corresponding to the opening in the package substrate. This creates an exposed area where the magnet can be mounted and accessed, while the encapsulant layer remains in other regions to provide protection for the electronic components. This selective removal resolves the contradiction by maintaining protection where needed while enabling magnet access where required.
Data Source
AI summary
A semiconductor package is disclosed. The semiconductor package comprises: a metal shim, a package substrate attached onto a front side of the metal shim, wherein the package substrate comprises an opening that passes therethrough; one or more electronic components mounted on the package substrate; an encapsulant layer partially formed on the package substrate to expose a region of the package substrate and the opening of the package substrate, wherein the encapsulant layer encapsulates the one or more electronic components on the package substrate; a first connector mounted in the exposed region of the package substrate; a second connector mounted in the encapsulant layer and on the package substrate; and a magnet mounted in the opening of the package substrate and extending from the metal shim through the package substrate and the encapsulant layer.