Semiconductor Package Magnetic Shielding for Rewiring Noise

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Solution Overview

Problem

Wafer level semiconductor packages experience electromagnetic noise due to magnetic fields generated by rewiring, which deteriorates image quality in solid-state imaging elements.

Innovation Solution

Incorporating a ferromagnetic material, such as permalloy, between the rewiring and the semiconductor integrated circuit to act as a magnetic shield, effectively blocking magnetic fields and improving image quality.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If rewiring is used to connect the semiconductor integrated circuit to external terminals, then electrical connection is achieved, but electromagnetic noise is generated that deteriorates image quality

Engineering Contradiction:
Improveelectrical connectionVSAvoidelectromagnetic noise
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

A ferromagnetic material layer is introduced as an intermediary between the rewiring and the solid-state imaging element. This intermediate layer acts as a magnetic shield that blocks the magnetic field generated by the rewiring from reaching the imaging element, thereby preventing electromagnetic noise while maintaining the electrical connection function of the rewiring.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent utilizes the ferromagnetic material's property of concentrating and redirecting magnetic field lines. The harmful magnetic field generated by the rewiring is not simply blocked but is redirected through the ferromagnetic material to a different path, converting the harmful electromagnetic interference into a controlled magnetic field distribution that does not affect the imaging element.

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

2Object-affected harmful factors

If a ferromagnetic material is added to block magnetic fields, then electromagnetic noise is inhibited, but device complexity increases

Engineering Contradiction:
Improveelectromagnetic noiseVSAvoidpackage structure
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The ferromagnetic material layer is merged with the existing package structure layers. Instead of adding a separate, distinct component, the ferromagnetic material is integrated into the package as one of the layered structures, combining the magnetic shielding function with the existing package architecture to minimize additional complexity.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The ferromagnetic material layer serves multiple functions: it acts as a magnetic shield to block electromagnetic noise, provides structural support as part of the package layers, and maintains electrical isolation between different components. This multi-functionality reduces the need for additional separate components, thereby limiting the increase in device complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The ferromagnetic material effectively inhibits electromagnetic noise, enhancing the image quality of image data by blocking magnetic fields and preventing signal transmission-induced noise in semiconductor packages.

Implementation Method 1

a ferromagnetic material provided between the wiring and the semiconductor integrated circuit. This causes the effect of blocking a magnetic field due to the ferromagnetic material.

Methodology Applied
Scientific EffectMagnetic shielding: Magnetic Field

Data Source

PatentUS12132063B2Semiconductor package and method for manufacturing semiconductor package
Publication Date: 2024.10.29 SONY SEMICON SOLUTIONS CORP
  • US12132063B2 patent drawing
  • US12132063B2 patent drawing
  • US12132063B2 patent drawing

AI summary

Electromagnetic noise is inhibited in a semiconductor package provided with rewiring.The semiconductor package includes a semiconductor integrated circuit, wiring, and a ferromagnetic material. In addition, in the semiconductor package including the semiconductor integrated circuit, the wiring, and the ferromagnetic material, the wiring connects the semiconductor integrated circuit to a predetermined external terminal. Further, in the semiconductor package including the semiconductor integrated circuit, the wiring, and the ferromagnetic material, the ferromagnetic material is provided between the wiring and the semiconductor integrated circuit.