Semiconductor Package Mask Opening Layout for Uniform Encapsulation
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Solution Overview
Problem
Existing semiconductor packages face limitations in packaging efficiency and process tolerance, particularly in the formation of semiconductor packages with integrated passive and active devices, where the bonding and encapsulation processes require improved precision and uniformity to enhance performance and reliability.
Innovation Solution
A semiconductor package formation method involving a redistribution layer structure, a carrier with a debonding layer, and a circuit board structure with a mask layer and encapsulation layer, where the opening pattern of the mask layer is designed to improve molding performance and process tolerance, allowing for the integration of both passive and active semiconductor chips with enhanced electrical connections and encapsulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional bonding and encapsulation processes are used for integrating passive and active semiconductor devices, then the packaging can be completed, but the molding uniformity and process tolerance are insufficient
Solution Approach 1:
The patent segments the semiconductor package into distinct functional layers: a first circuit board structure for passive devices, a second circuit board structure for active devices, and an intermediate carrier with debonding layer. This segmentation allows each layer to be optimized and processed independently, improving molding uniformity and process tolerance while maintaining overall package reliability.
2Adaptability or versatility
If multiple semiconductor devices are integrated in a single package, then functionality is enhanced, but bonding precision and electrical connection reliability become more difficult to maintain
Solution Approach 1:
The patent introduces a carrier with a debonding layer as an intermediary structure between the first and second circuit board structures. This intermediary enables precise positioning and bonding of multiple semiconductor devices during assembly, then allows controlled release from the carrier after bonding, maintaining bonding precision even as device integration increases.
3Productivity
If the package structure is simplified to reduce manufacturing complexity, then production efficiency increases, but encapsulation uniformity and device protection may be compromised
Solution Approach 1:
The patent applies preliminary action by pre-forming the carrier with the debonding layer and pre-positioning the passive and active devices on the respective circuit board structures before final encapsulation. This preliminary arrangement ensures that when encapsulation material is applied, it uniformly covers all devices and interconnections, maintaining encapsulation uniformity while streamlining the overall manufacturing process for higher productivity.
Data Source
AI summary
A semiconductor package includes a redistribution layer structure, a first semiconductor chip, a circuit board structure and an encapsulation layer. The redistribution layer structure has a first side and a second side opposite to the first side. The first semiconductor chip is electrically connected to the first side of the redistribution layer structure. The circuit board structure is electrically connected to the first side of the redistribution layer structure, and the circuit board structure includes a first mask layer having an opening pattern that corresponds to first semiconductor chip. The encapsulation layer laterally encapsulates the circuit board structure and fills in a space between the semiconductor chip and the opening pattern of the first mask layer of the circuit board structure.