Semiconductor Package With Integrated Measuring Device
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor devices lack effective real-time monitoring and control mechanisms for physical variations such as temperature and strain, which can impact their performance and reliability, especially in mobile devices where various application programs operate.
Innovation Solution
A semiconductor package is designed with a measuring device, such as a thermocouple or strain gauge, integrated on the semiconductor chip, which measures physical variations and outputs signals to a controller to adjust the device's operation, including reducing operating speed when temperatures exceed a reference level.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If physical variation measurement is implemented to improve performance and reliability, then device complexity increases due to additional measuring devices and control mechanisms
Solution Approach 1:
The measuring device is integrated directly on the semiconductor chip, merging the measurement function with the existing chip structure. This integration reduces the need for separate external measurement components and simplifies the overall device architecture while maintaining the ability to monitor physical variations.
Solution Approach 2:
The measuring device is designed to measure multiple types of physical variations (temperature, strain, etc.) using a single integrated structure. This multi-functional approach allows one component to perform multiple measurement tasks, reducing the total number of components needed and thereby decreasing device complexity.
2Reliability
If real-time monitoring and control mechanisms are added to measure physical variations, then device complexity increases due to additional components and control systems
Solution Approach 1:
The control mechanism is integrated with the measuring device and semiconductor chip, combining multiple functions (measurement, signal processing, and control) into a unified system. This integration eliminates the need for separate external control components and reduces overall device complexity.
Solution Approach 2:
The system implements a feedback mechanism where the measuring device continuously monitors physical variations and provides real-time data to the control mechanism, which adjusts device operation accordingly. This closed-loop feedback enables automatic adaptation to physical variations without requiring complex external monitoring systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables real-time monitoring and control of semiconductor devices, enhancing their performance and reliability by adjusting operations based on measured physical variations, thereby improving overall device stability and efficiency.
Implementation Method 1
the measuring device may include a thermocouple having metal patterns of metal materials that are different from each other and are on an insulating layer of the semiconductor device
Implementation Method 2
the measuring device may include a strain gauge having a metal grid on an insulating layer of the semiconductor device
Data Source
AI summary
A semiconductor package includes a package substrate having first connecting pads and second connecting pads, and a semiconductor chip mounted on the package substrate. The semiconductor chip includes a semiconductor device comprising a semiconductor substrate and electrically connected to input/output (I/O) pads, and a measuring device formed on the semiconductor device and electrically connected to measuring pads. The I/O pads are electrically connected to the first connecting pads, and the measuring pads are electrically connected to the second connecting pads.