Semiconductor Package Mechanical Fixation and Inductive Power

Solution Overview

Problem

Conventional semiconductor package mounting using solder balls makes it difficult to replace defective packages without damaging non-defective ones, leading to increased costs due to the need for repeated infrared reflow processes, which stress all packages on the mounting board.

Innovation Solution

A semiconductor package configuration that includes a package board with a coil for electromagnetic induction, a pellet with a circuit, and a protection member, allowing for mechanical fixation and power supply without solder balls, enabling the replacement of defective packages without heat stress to non-defective ones.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of repair

If solder balls are used to mount semiconductor packages, then electrical connection is achieved, but replacement of defective packages becomes difficult due to heat stress on non-defective packages

Engineering Contradiction:

Improvepackage replacementVSAvoidheat stress

Core Design Contradiction:

Ease of repairVSObject-affected harmful factors

Solution Approach 1:

The patent replaces the thermal-based soldering system with a mechanical fixation system. Instead of using solder balls that require infrared reflow heating, the invention uses mechanical fastening methods such as clips, latches, or interlocking structures to attach semiconductor packages to the mounting board. This mechanical substitution eliminates the need for repeated heating cycles, allowing defective packages to be removed and replaced without subjecting non-defective packages to thermal stress.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Ease of repair

If infrared reflow processing is performed repeatedly, then defective packages can be replaced, but non-defective packages suffer from cumulative heat stress

Engineering Contradiction:

Improvedefective package replacementVSAvoidnon-defective package functionality

Core Design Contradiction:

Ease of repairVSReliability

Solution Approach 1:

The patent replaces the thermal-based soldering system with a mechanical fixation system. Instead of using solder balls that require infrared reflow heating, the invention uses mechanical fastening methods such as clips, latches, or interlocking structures to attach semiconductor packages to the mounting board. This mechanical substitution eliminates the need for repeated heating cycles, allowing defective packages to be removed and replaced without subjecting non-defective packages to thermal stress.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Productivity

If solder balls are used for mounting, then electrical connection is established, but the mounting board must be discarded when any package is defective

Engineering Contradiction:

Improvemounting board utilizationVSAvoidpackage replacement

Core Design Contradiction:

ProductivityVSEase of repair

Solution Approach 1:

The patent replaces the thermal-based soldering system with a mechanical fixation system. Instead of using solder balls that require infrared reflow heating, the invention uses mechanical fastening methods such as clips, latches, or interlocking structures to attach semiconductor packages to the mounting board. This mechanical substitution eliminates the need for repeated heating cycles, allowing defective packages to be removed and replaced without subjecting non-defective packages to thermal stress.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent enables recovery and reuse of the mounting board by allowing individual package replacement. With mechanical fixation, defective packages can be removed and replaced without damaging the mounting board or affecting non-defective packages, thereby recovering the value of the mounting board and avoiding the need to discard the entire assembly when a single package fails.

Inventive Principle:

Principle #34Discarding and recovering

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables the mechanical dismounting and replacement of defective semiconductor packages without applying heat, reducing costs and ensuring non-defective packages remain functional, thus preventing the need to discard entire mounting boards.

Implementation Method 1

a coil that supplies power based on an induced current passed in response to change in magnetic flux

Methodology Applied

Scientific EffectElectromagnetic induction: Electromagnetic Induction

Data Source

PatentUS8723301B2Semiconductor package and system

Publication Date: 2014.05.13 RENESAS ELECTRONICS CORP

AI summary

A semiconductor package includes a package board, a pellet provided over the package board, and a protection member covering the package board and the pellet and including a hole penetrating the protection member.