Semiconductor Package Metal Block Thermal Conduction Path
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Solution Overview
Problem
Current semiconductor packages face thermal overload issues due to inadequate heat dissipation, with DSC packages limiting heat removal into PCBs and TSC packages presenting challenges in effective cooling.
Innovation Solution
A semiconductor package design featuring a semiconductor die with load terminals on both sides, a metal block providing a single primary thermal conduction path, and exposed metal leads embedded in a mold compound for surface mounting on either side, allowing for flexible heat removal configurations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If DSC (double side cool) packages are used to dissipate heat, then heat removal capability is improved, but thermal overload limit is reached and heat still flows into PCB
Solution Approach 1:
The patent extracts the heat dissipation function from the PCB by introducing a separate metal block with high thermal conductivity that carries heat away from the semiconductor die directly, bypassing the PCB thermal path and preventing PCB thermal overload
Solution Approach 2:
The patent segments the thermal management system into distinct paths: one path through the metal block for primary heat removal, and another path through the PCB for secondary heat dissipation, allowing independent optimization of each thermal path
2Reliability
If TSC (top side cool) packages are used to carry heat away from PCB, then PCB thermal overload is addressed, but significant challenges exist in implementing effective cooling
Solution Approach 1:
The metal block serves multiple functions simultaneously: it provides the primary thermal conduction path for heat removal, acts as an electrical connection element, and enables both top-side and bottom-side mounting configurations, reducing overall device complexity
Solution Approach 2:
The patent creates a dynamic mounting system where the package can be mounted on either the top side or bottom side of the PCB depending on the thermal management requirements, allowing flexible adaptation to different cooling implementations
3Temperature
If a single primary thermal conduction path is provided through a metal block, then heat removal efficiency is improved, but manufacturing complexity increases
Solution Approach 1:
The patent merges the thermal conduction function, electrical connection function, and mechanical support function into a single metal block component, simplifying the manufacturing process while maintaining efficient heat removal through the consolidated structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The package effectively manages heat dissipation by providing a single primary thermal conduction path, enabling efficient heat removal from either side, thus addressing thermal overload limitations in existing technologies.
Implementation Method 1
a metal block attached to the second load terminal of the semiconductor die and providing a single primary thermal conduction path of the package
Data Source
AI summary
A package includes a semiconductor die having a first load terminal at a first side and a second load terminal at a second side opposite the first side, a metal block attached to the second load terminal and providing a single primary thermal conduction path of the package, a first metal lead electrically connected to the first load terminal, a second metal lead electrically connected to the second load terminal, and a mold compound embedding the semiconductor die, the metal block, and each metal lead. Each metal lead and the metal block are exposed from the mold compound at a first side of the package. Each metal lead is exposed from the mold compound at a second side of the package opposite the first side, so that the package is configured for surface mounting at either the first side or the second side of the package.