Semiconductor Package Thermal Management via Metal Carrier and Conductive Posts
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Solution Overview
Problem
The increasing complexity and power consumption of integrated circuit (IC) assemblies lead to heat dissipation challenges, limiting the design of semiconductor chip packaging as existing technologies struggle to effectively manage the rising heat generated by denser IC chips.
Innovation Solution
A package structure incorporating a metal carrier, conductive posts, and redistribution layers to form interconnections between semiconductor chips and dissipate heat, featuring a conductive adhesive layer and redistribution layers to enhance thermal management and layout flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If IC chips are made denser with smaller sizes and higher circuit densities, then the electrical power consumption per unit volume increases, but the heat generation also increases correspondingly, making heat dissipation more difficult
Solution Approach 1:
The patent extracts the heat dissipation function from the traditional packaging structure by introducing a dedicated heat sink structure with thermal vias that conduct heat away from the IC chip. The heat sink is coupled to the IC chip through a thermally conductive adhesive layer, separating the heat generation source from the packaging materials that would otherwise trap heat.
Solution Approach 2:
The patent introduces a thermally conductive adhesive layer as an intermediary between the IC chip and the heat sink. This adhesive layer serves as a thermal bridge that efficiently transfers heat from the chip to the heat sink while maintaining mechanical bonding, resolving the contradiction between maintaining chip attachment and enabling effective heat dissipation.
2Temperature
If the metal carrier and conductive posts are used as heat sink, then heat dissipation is improved, but the device complexity increases due to additional components and interconnections
Solution Approach 1:
The patent makes the metal carrier and conductive posts serve multiple functions: they provide electrical interconnections between IC chips and simultaneously act as a heat sink for thermal management. The conductive adhesive layer also serves dual purposes of mechanical bonding and thermal conduction. This multi-functionality reduces the need for separate dedicated heat dissipation components.
Solution Approach 2:
The patent merges the electrical interconnection function and thermal management function into a unified structure. The metal carrier and conductive posts that provide electrical pathways are also configured to conduct heat away from the IC chips, combining two essential functions into integrated structural elements rather than separate components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively dissipates heat generated by semiconductor chips, improving their performance by utilizing metal carriers and conductive posts as a heat sink, while providing high layout flexibility through interconnections between semiconductor chips.
Implementation Method 1
a conductive adhesive layer disposed on the metal carrier... effectively dissipates heat generated by semiconductor chips, improving their performance by utilizing metal carriers and conductive posts as a heat sink
Implementation Method 2
utilizing metal carriers and conductive posts as a heat sink, while providing high layout flexibility through interconnections between semiconductor chips
Data Source
AI summary
A package structure includes a metal carrier, a conductive adhesive layer disposed on the metal carrier, a conductive post disposed on the conductive adhesive layer, a semiconductor chip disposed on the conductive adhesive layer and laterally spaced from the conductive post, and a redistribution layer disposed on the conductive post and the semiconductor chip. The semiconductor chip includes a first terminal at an upper surface of the semiconductor chip. The first terminal of the semiconductor chip is electrically connected to the bottom surface of the semiconductor chip through the redistribution layer, the conductive post and the conductive adhesive layer.