Stack-Type Semiconductor Package With Metal Layer EMI Shield
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Solution Overview
Problem
Current stack-type semiconductor packages face challenges in achieving high integration density and reliability, particularly in maintaining electrical connections with fine ball pitches and effectively managing heat and electromagnetic interference (EMI).
Innovation Solution
The proposed solution involves a stack-type semiconductor package structure with a lower and upper semiconductor package, connection pads, and a metal layer pattern. The connection pads are formed on via holes and encapsulants, electrically connecting the packages and surrounded by a metal layer pattern that functions as both a heat sink and EMI shield, allowing for fine ball pitches and improved reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If connection pads are formed to electrically connect lower and upper semiconductor packages with fine ball pitches, then integration density is improved, but manufacturing precision and reliability become more difficult to maintain
Solution Approach 1:
The patent introduces a metal layer pattern as an intermediary component between the connection pads and the solder balls. This metal layer pattern includes a pad region that contacts the solder ball and a shield region that extends outward, mediating the electrical connection while providing EMI shielding. The intermediary structure allows for more tolerant alignment tolerances compared to direct pad-to-ball connections, thus improving manufacturability while maintaining fine pitch capabilities.
Solution Approach 2:
The connection structure is segmented into distinct functional regions: the connection pad for electrical connection, the metal layer pattern with pad region and shield region, and the via hole structure. This segmentation allows each component to be optimized independently - the pad region for electrical connectivity and the shield region for EMI protection - while collectively solving the fine pitch connection challenge with improved reliability.
2Reliability
If metal layer pattern is added to surround connection pads for EMI shielding and heat dissipation, then reliability is improved, but device complexity increases
Solution Approach 1:
The metal layer pattern is designed to perform multiple functions simultaneously: the pad region provides electrical connection to the solder ball, while the extended shield region provides EMI shielding. This multi-functional design eliminates the need for separate EMI shielding structures, reducing overall device complexity while maintaining improved reliability through integrated EMI protection and heat dissipation capabilities.
3Reliability
If via holes are formed in encapsulant to expose lower solder balls, then electrical connection is improved, but manufacturing complexity increases
Solution Approach 1:
The via holes are formed in the encapsulant layer during the packaging process before the metal layer pattern is applied. This preliminary action allows the via hole structure to be established early in the manufacturing sequence, simplifying subsequent steps. The pre-formed via holes provide ready-made pathways for electrical connection, reducing the complexity of later assembly operations while ensuring reliable electrical connectivity between layers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables the creation of semiconductor packages with enhanced heat radiation efficiency and increased reliability by effectively dissipating heat and shielding against electromagnetic interference, while allowing for a fine ball pitch, thus improving integration density and durability.
Implementation Method 1
a metal layer pattern that functions as both a heat sink and EMI shield
Implementation Method 2
a metal layer pattern that functions as both a heat sink and EMI shield
Implementation Method 3
connection pads electrically connecting the lower semiconductor package and the upper semiconductor package
Data Source
AI summary
According to example embodiments, a stack-type semiconductor package includes a lower semiconductor package, an upper semiconductor package, connection pads, and a metal layer pattern. The lower semiconductor package includes a lower semiconductor chip on a top surface of a lower package substrate, lower lands on the lower package substrate, and an encapsulant on the top surface of the lower package substrate. The encapsulant defines via holes that expose the lower lands. The upper semiconductor package is on the encapsulant. Upper solder balls are connected to a bottom surface of the upper semiconductor package. The connection pads are on the via holes and the encapsulant. The connection pads electrically connect the lower semiconductor package to the upper semiconductor package. The metal layer pattern is between the lower package substrate and the upper semiconductor package. The metal layer pattern surrounds the connection pads and is isolated from the connection pads.