Multi-Layer Semiconductor Package for High-Resolution Display Connectivity
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Solution Overview
Problem
There is a need for semiconductor packages that can meet the performance demands of high-resolution display devices, particularly in terms of electrical connectivity and alignment to prevent misalignment and electrical shorts, especially in applications with a large number of channels and small channel pitches.
Innovation Solution
A semiconductor package design featuring multiple metal pattern layers on a package substrate, including an upper metal pattern layer for external connection, a lower metal pattern layer for another external device, and an intermediate layer connecting them, with specific arrangements of leads and pads to ensure proper alignment and electrical connectivity without misalignment or shorts, utilizing flexible or rigid substrates and passivation layers for exposure and protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multiple metal pattern layers are used to increase the number of channels for high-resolution displays, then the channel capacity increases, but the risk of lead misalignment and electrical shorts increases
Solution Approach 1:
The patent transitions from a single-plane lead arrangement to a multi-layer three-dimensional structure. Multiple metal pattern layers are stacked vertically with intermediate connection layers, allowing channels to be organized in different spatial dimensions. This reduces lateral crowding and misalignment risks while increasing channel capacity.
Solution Approach 2:
The lead connection structure is segmented into multiple independent metal pattern layers (upper, intermediate, lower) rather than using a single continuous layer. Each layer can be independently aligned and connected, reducing the cumulative alignment error that would occur in a single dense layer with many channels.
2Quantity of substance
If the channel pitch is reduced to increase resolution, then more channels fit in the same area, but the manufacturing precision requirements increase
Solution Approach 1:
By stacking metal pattern layers vertically, the patent moves channel density from a two-dimensional constraint to a three-dimensional solution. Smaller channel pitch in the lateral direction is compensated by adding vertical layers, reducing the manufacturing precision burden on any single layer while maintaining high overall channel density.
Solution Approach 2:
Intermediate connection layers act as mediators between upper and lower metal pattern layers. These intermediate layers provide alignment reference structures and connection points that facilitate precise registration across multiple layers, reducing the cumulative alignment error that would otherwise accumulate.
3Quantity of substance
If multiple metal pattern layers are added to increase channel capacity, then the electrical connectivity improves, but the device complexity increases
Solution Approach 1:
Multiple metal pattern layers and intermediate connection layers are merged into an integrated multi-layer structure that functions as a unified electrical connection system. This consolidation manages complexity by creating a systematic architecture rather than separate discrete components.
Solution Approach 2:
The intermediate connection layers serve multiple functions: they connect upper and lower metal patterns, provide alignment references, and can serve as additional electrical connection points. This multi-functionality reduces the need for separate dedicated structures for each function.
Data Source
AI summary
A semiconductor package includes a substrate having a top surface on which a semiconductor chip is mounted and a bottom surface opposite the top surface, an upper metal pattern including an upper connection region to which an external electrical device is connected and a chip connection region to which the semiconductor chip is connected, a lower metal pattern including a lower connection region to which other external electrical device is connected, and an intermediate metal pattern electrically connecting the upper and lower metal patterns. The upper metal pattern provides at least three groups of inner leads. The lower metal pattern provides at least three groups of outer leads. A module, such as that of a display device, may include the semiconductor package.