Semiconductor Package Metal Plate Core Substrate High-Density Wiring
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Solution Overview
Problem
The existing semiconductor device packaging methods require lengthy processing times and increased costs due to the need for drilling through holes, limiting hole diameter and pitch, which restricts wiring density and increase resistance values.
Innovation Solution
A semiconductor device package is formed using two metal plates with through holes and projections, stacked to create a core substrate with an insulating layer, allowing for high-density wiring and reduced resistance through press or etching processing, with terminal portions exposed for external connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If through holes are formed by drilling on a glass epoxy resin substrate, then the processing can be completed, but the processing time becomes long and the cost increases
Solution Approach 1:
The patent replaces the mechanical drilling system with a laser-based system. The laser beam forms through holes by melting and evaporating the glass epoxy resin substrate, eliminating the need for physical drill bits and mechanical force application. This substitution of mechanical processing with optical/thermal processing resolves the contradiction by enabling faster hole formation without the time constraints and cost limitations of drilling operations.
2Manufacturing precision
If through holes are formed by drilling, then the holes can be created, but the hole diameter and pitch cannot be reduced
Solution Approach 1:
The patent utilizes laser parameter control (power, pulse duration, focal position) to precisely control hole diameter and pitch. By adjusting laser processing parameters, the system can create holes of varying sizes and spacing without the physical constraints of drill bit dimensions. This enables reduced hole diameter and pitch while maintaining ease of manufacture through non-contact processing.
3Manufacturing precision
If through holes are formed by drilling, then the holes can be created, but the wiring density cannot be increased
Solution Approach 1:
The laser-based hole formation system enables higher wiring density by creating smaller, more precisely positioned through holes without the mechanical limitations of drilling. The non-contact nature of laser processing allows for rapid formation of multiple high-density holes, simultaneously achieving increased wiring density while reducing processing time compared to traditional drilling methods.
4Reliability
If power layer and ground layer are formed by electrolytic plated film, then the layers can be created, but the thickness cannot be increased and resistance value increases
Solution Approach 1:
The patent transitions from electrolytic plating to laser sintering of conductive paste for forming power and ground layers. By controlling laser parameters (power, scanning speed, multiple passes), the system can precisely control the thickness of conductive layers and optimize their electrical properties. This enables increased thickness and reduced resistance values while maintaining reliable layer formation, resolving the limitations of electrolytic plating.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the formation of small-diameter, high-density wiring with reduced resistance and enhanced package strength, facilitating efficient semiconductor device manufacturing.
Implementation Method 1
an insulating layer formed on its surface
Data Source
AI summary
In a package for a semiconductor device, a core substrate has two metal plates, each of which includes a first through hole, a second through hole, a projection, and an insulating layer formed on its surface. The metal plates are stacked in a manner that the projections of the mutual metal plates enter the second through hole of the metal plate on a partner side, and the first through holes of the metal plates form a through hole penetrating the core substrate. A tip end of each of the projections of the metal plates is exposed to a surface of the metal plate on the partner side to form a first terminal portion, and a second terminal portion is exposed from the insulating layer and formed on a surface of the metal plate on a side where the first terminal portion of the metal plate on the partner side is exposed.