Semiconductor Package Metal Resin Adhesion via Roughened Trenches
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional semiconductor devices face issues with peeling of the molding resin from the metal lead frame, which can expose the semiconductor element to the ambient environment and compromise protection.
Innovation Solution
A package structure is designed with a metal member having a roughened surface area, featuring trenches and ridges that increase surface roughness, allowing for enhanced adhesion with a resin member, preventing peeling and corrosion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a smooth surface is used for the metal member, then the manufacturing process is simple, but the adhesion strength between the resin member and metal member is insufficient causing peeling
Solution Approach 1:
The invention applies local quality by creating trenches only in specific areas where enhanced adhesion is needed, rather than modifying the entire surface uniformly. The trenches are formed in the roughened area of the metal member to provide localized anchoring points for the resin member, improving adhesion strength where required while maintaining simplicity in other areas.
Solution Approach 2:
The invention applies preliminary action by pre-forming trenches and roughening the surface of the metal member before the resin member is applied. This preparatory structuring creates anchor points in advance that enhance the bonding interface, ensuring strong adhesion from the outset and preventing peeling during subsequent use.
2Volume of moving object
If the resin member is made thin to reduce size, then the package structure is more compact, but the resin member becomes more susceptible to peeling
Solution Approach 1:
The invention applies local quality by concentrating adhesion enhancement features (trenches and roughening) at the bonding interface between the resin and metal, rather than increasing the overall resin thickness. This allows the resin member to remain thin for compact packaging while the localized structural features provide sufficient anchoring to prevent peeling.
3Strength
If a roughened surface with trenches is created on the metal member, then the adhesion strength is enhanced, but the manufacturing process becomes more complex
Solution Approach 1:
The invention applies local quality by limiting the trench formation and surface roughening to specific localized areas on the metal member rather than treating the entire surface. This reduces the overall manufacturing complexity and material removal while still providing sufficient adhesion enhancement at the critical bonding interface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents peeling of the resin from the metal member, ensuring the semiconductor element remains protected and enhancing the adhesion strength between the metal and resin, thus improving the durability of the semiconductor device.
Implementation Method 1
The obverse surface has a roughened area. The roughened area includes a plurality of first trenches recessed from the obverse surface... The plurality of first trenches are filled up with the resin member.
Implementation Method 2
The resin member adheres to the lead frame and thus supported on the lead frame... enhancing the adhesion strength between the metal and resin
Data Source
AI summary
A package structure includes a metal member and a resin member. The metal member has an obverse surface facing one side in a first direction. The resin member is disposed in contact with at least a portion of the obverse surface. The obverse surface has a roughened area. The roughened area includes a plurality of first trenches recessed from the obverse surface, each of the first trenches having a surface with a greater roughness than the obverse surface. The plurality of first trenches extend in a second direction perpendicular to the first direction and are next to each other in a third direction perpendicular to the first direction and the second direction. The plurality of first trenches are filled up with the resin member.