Semiconductor Package Metal Substrate Etching and Plating
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Solution Overview
Problem
The manufacturing of semiconductor packages with metal substrates requires high alignment precision and reliable contact between semiconductor devices and lines, while also ensuring high yield and electromagnetic shielding characteristics, which existing methods struggle to achieve consistently.
Innovation Solution
A manufacturing method involving etching of a stainless steel substrate, attaching a metal with lower ionization tendency, forming conductive layers, and using electroless plating to improve adhesiveness, along with resin insulating layers and solder balls for precise alignment and separation of individual packages.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a metal substrate is used for semiconductor packages, then electromagnetic shielding characteristics and thermal characteristics are improved, but alignment precision and contact reliability between semiconductor devices and lines become difficult to ensure
Solution Approach 1:
The patent applies preliminary action by performing etching and metal attachment on the metal substrate before mounting the semiconductor device. This pre-treatment creates a surface structure that facilitates precise alignment and reliable contact, resolving the contradiction between maintaining electromagnetic shielding properties and achieving manufacturing precision.
Solution Approach 2:
The patent introduces an intermediate metal layer attached to the metal substrate through etching. This intermediate layer acts as a mediator that improves adhesion and alignment precision between the semiconductor device and the metal substrate, while preserving the electromagnetic shielding characteristics of the underlying metal substrate.
2Productivity
If multiple semiconductor devices are mounted on a large support substrate for mass production, then productivity is improved, but separation yield into individual packages becomes difficult to ensure
Solution Approach 1:
The patent applies segmentation by forming separation grooves that divide the large metal substrate into multiple individual package regions. This allows mass production of multiple semiconductor devices while ensuring clean separation into individual packages with high yield, resolving the contradiction between productivity and separation reliability.
3Ease of manufacture
If conventional mounting methods are used on metal substrates, then manufacturing simplicity is maintained, but adhesiveness between substrate and plating layers is insufficient
Solution Approach 1:
The patent applies composite materials by creating a multi-layer structure consisting of the metal substrate, etched surface, attached metal layer, and plating layers. This composite structure enhances adhesiveness between the substrate and plating layers while maintaining manufacturing simplicity through a systematic process flow.
Solution Approach 2:
The patent applies parameter changes by modifying the surface properties of the metal substrate through etching and metal attachment. These parameter changes in surface roughness and composition improve adhesiveness without significantly complicating the manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances the adhesiveness between the substrate and plating layers, improves yield, and achieves high alignment precision, resulting in semiconductor packages with superior electromagnetic shielding and thermal characteristics.
Implementation Method 1
The etching may be wet etching using an etchant containing ions of the metal which is to be attached to the first surface and the side surface.
Implementation Method 2
The metal layer may be formed by electroless plating.
Implementation Method 3
This method enhances the adhesiveness between the substrate and plating layers
Data Source
AI summary
A manufacturing method of a semiconductor package includes etching a first surface and a side surface of a base substrate, the base substrate including the first, a second and the side surfaces positioned between the first and the second surfaces, the base substrate containing a metal, attaching a metal different from the metal contained in the base substrate to the first and the side surfaces, disposing a semiconductor device on the second surface, the semiconductor device having an external terminal, forming a resin insulating layer sealing the semiconductor device, forming a first conductive layer on the resin insulating layer, forming an opening, exposing the external terminal, in the first conductive layer and the resin insulating layer; and forming a metal layer on the first and the side surfaces, on the first conductive layer and in the opening.