Semiconductor Package Hermetic Sealing via Metallic Bridging
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Solution Overview
Problem
Existing semiconductor packages face increased thermal impedance when using thermal interface materials instead of direct metal bonding, leading to degraded heat dissipation, and are vulnerable to catastrophic failures due to coolant leakage when seals or gaskets fail.
Innovation Solution
A semiconductor package with a metallic enclosure and bridging connection that hermetically seals the perimeter gap between the metallic base and enclosure, eliminating the need for seals and allowing direct coolant circulation without leakage, while maintaining electrical insulation and thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If thermal interface material is used between semiconductor package and cold plate, then ease of assembly is improved, but thermal impedance increases and heat dissipation is degraded
Solution Approach 1:
The patent removes the thermal interface material from the heat dissipation path between the semiconductor device and cold plate, extracting the source of thermal impedance. The direct metal-to-metal bonding eliminates the intermediate layer that causes thermal resistance, achieving both easy assembly and optimal thermal performance.
Solution Approach 2:
The semiconductor package structure merges the sealing function and thermal conduction function into a single integrated metallic enclosure and base assembly. The metallic components serve dual purposes: providing hermetic sealing for coolant circulation and maintaining low thermal impedance for efficient heat dissipation.
2Reliability
If seals or gaskets are used to bound coolant volumes, then coolant containment is improved, but reliability deteriorates due to vulnerability to leakage and catastrophic failure
Solution Approach 1:
The patent extracts and eliminates seals and gaskets from the coolant containment system. The metallic enclosure and base with integrated bridging connections provide hermetic sealing without relying on elastomeric or composite sealing materials that are prone to degradation and leakage.
Solution Approach 2:
The patent employs a composite metallic structure with dielectric regions and conductive bridging connections that simultaneously provides electrical insulation, thermal conduction, and hermetic sealing. This eliminates the need for separate sealing components while maintaining coolant containment integrity.
3Temperature
If direct metal bonding is used instead of thermal interface material, then thermal impedance is reduced and heat dissipation is improved, but manufacturing complexity increases
Solution Approach 1:
The metallic enclosure and base are pre-formed with integrated bridging connections and dielectric regions during manufacturing. This preliminary preparation of the sealing and thermal conduction structures eliminates the need for complex assembly operations, making direct metal bonding as easy as conventional techniques.
4Reliability
If metallic enclosure with bridging connection is used to eliminate seals, then reliability is improved by preventing coolant ingress, but device complexity increases
Solution Approach 1:
The metallic enclosure and base structure performs multiple functions simultaneously: providing hermetic sealing for coolant containment, establishing low thermal impedance heat dissipation paths, and enabling electrical connections through dielectric regions with conductive bridging. This multi-functionality reduces the need for separate components despite the enhanced protection requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances thermal dissipation and prevents coolant ingress, ensuring reliable operation and increased power capability for semiconductor switch modules without the risk of catastrophic failures from coolant leakage.
Implementation Method 1
A metallic bridging connection fills and hydraulically seals (e.g., or hermetically seals) what would otherwise be a perimeter gap between the metallic base and the metallic enclosure
Implementation Method 2
If thermal interface material is used rather than a direct metal bonding or solder connection, thermal impedance for the system of the semiconductor package and the cold plate tends to be increased; hence, heat dissipation of a semiconductor device can be degraded
Implementation Method 3
The metallic enclosure has a set of dielectric regions for embedded or pass-through electrical terminals that are electrically insulated or isolated from the metallic enclosure
Data Source
AI summary
A package for a semiconductor device or circuit comprises a semiconductor switch module having a metallic base on an exterior side and metallic pads. A metallic enclosure is arranged for receiving the semiconductor switch module. The metallic enclosure has a recess of a size and shape for receiving the semiconductor switch module. The metallic enclosure has a set of dielectric regions with embedded or pass-through electrical terminals that are electrically insulated or isolated from the metallic enclosure. The electrical terminals are electrically connected to the metallic pads. A metallic bridging connection fills and hydraulically seals what would otherwise be a perimeter gap between the metallic base and the metallic enclosure.