Semiconductor Package Structure With Metallic Heat-Spreading Interface
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Solution Overview
Problem
The miniaturization of electronic products has led to issues with heat dissipation and warpage in package structures, causing delamination and cracking due to thermal cycling, which can result in catastrophic failures.
Innovation Solution
A package structure is formed with a thermal conductive structure between the semiconductor die and the lid, incorporating a metallic layer over the insulating encapsulation to enhance thermal coupling and prevent interfacial delamination, using a thermal interface material to attach a heat dissipating component.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a thermal conductive structure is disposed between the back side of the semiconductor die and the lid, then heat dissipation is improved, but thermal cycling induces stress causing delamination and cracking
Solution Approach 1:
The patent changes the physical and chemical parameters of the interface between the semiconductor die and lid by introducing a metallic layer with specific material properties (thermal conductivity, coefficient of thermal expansion) that differ from conventional direct bonding. This parameter change allows for better thermal management while reducing thermal stress through the metallic layer's ability to accommodate expansion differences.
Solution Approach 2:
The patent employs a composite structure consisting of the semiconductor die, metallic layer, and lid as distinct material layers with different properties. This composite approach allows each layer to contribute its specific characteristics: the semiconductor die for electronic function, the metallic layer for thermal conduction and stress management, and the lid for structural support and additional heat dissipation.
2Volume of moving object
If the package structure is miniaturized, then product size is reduced, but heat dissipation becomes more difficult and warpage increases
Solution Approach 1:
The patent addresses heat dissipation challenges in miniaturized packages by extending the thermal management solution into the vertical dimension. The metallic layer and lid create additional thermal pathways in the Z-direction (vertical axis), allowing heat to be conducted away from the semiconductor die through thickness rather than requiring larger lateral heat sink areas.
Solution Approach 2:
The patent applies local quality by concentrating thermal management resources at the heat-generating location. The metallic layer is positioned directly at the back side of the semiconductor die where heat is generated, providing localized high thermal conductivity exactly where needed, rather than requiring uniform thermal properties throughout the entire package structure.
3Temperature
If a metallic layer is formed on the insulating encapsulation, then thermal coupling is enhanced, but manufacturing complexity increases
Solution Approach 1:
The patent merges multiple functions into the metallic layer formation step: the metallic layer simultaneously serves as a thermal conduction path, an adhesive bonding layer between the insulating encapsulation and lid, and a stress-management interface. This consolidation reduces the need for separate adhesive layers and simplifies the overall manufacturing process despite the added metallic layer.
Solution Approach 2:
The metallic layer is designed to perform multiple functions: thermal conduction, mechanical bonding, and stress distribution. This multi-functionality reduces the total number of components and layers needed in the package structure, as the metallic layer replaces what would otherwise require separate thermal interface material and adhesive layers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively addresses heat dissipation and warpage issues, enhancing reliability and performance by improving thermal conductivity and preventing delamination, thus ensuring structural integrity and efficient heat management.
Implementation Method 1
a thermal conductive structure disposed between the back side of the semiconductor die and the lid
Implementation Method 2
using a thermal interface material to attach a heat dissipating component
Data Source
AI summary
A manufacturing method of a package structure includes: forming a first package component over a temporary carrier, wherein the first package component comprises a semiconductor die encapsulated by an insulating encapsulation material that comprises a base layer and a plurality of fillers inside the base layer; de-bonding the temporary carrier to expose a rear side of the semiconductor die, wherein during the de-bonding, a portion of the fillers is accessibly revealed from the base layer to form an insulating encapsulation; forming a metallic layer on the rear side of the semiconductor die and the portion of the fillers of the insulating encapsulation; and coupling a heat dissipating component to the first package component at least through the metallic layer.