Semiconductor Package Metallic Shell Thermal Dissipation
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Solution Overview
Problem
Semiconductor devices face inefficiencies due to inadequate cooling, primarily caused by the low thermal conductivity and thickness of epoxy housings, which can lead to molding failures and insulation breakdowns when attempting to reduce housing thickness for better thermal conduction.
Innovation Solution
A semiconductor device design featuring a semiconductor package with a thermally conductive adhesive layer and a metallic shell, such as an aluminum clip, encloses the package, allowing for dual-sided heat dissipation and reduced thickness without increasing cost or complexity, using a dielectric, thermally conductive epoxy and molding compound to enhance thermal conductivity and dielectric strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the thickness of the epoxy housing is reduced to achieve better thermal conduction, then thermal performance is improved, but molding failures such as IPE or voids increase leading to insulation breakdown
Solution Approach 1:
The patent applies composite materials by combining epoxy housing with a metallic shell (aluminum or other metals) that has superior thermal conductivity. The metallic shell is attached to the epoxy housing using thermally conductive adhesive, creating a composite structure that leverages the electrical insulation properties of epoxy and the thermal conduction properties of metal, thereby resolving the contradiction between thermal performance and insulation strength
Solution Approach 2:
The patent changes the thermal conductivity parameter of the housing structure by adding a metallic shell with high thermal conductivity to the epoxy housing. This parameter change enables the housing to maintain adequate thickness for insulation while achieving improved thermal conduction through the metallic component
2Temperature
If additional cooling features are incorporated to improve heat dissipation, then thermal performance is improved, but cost and device complexity increase
Solution Approach 1:
The metallic shell serves multiple functions simultaneously: it acts as a thermal conduction path for heat dissipation, provides mechanical protection for the semiconductor components, and can serve as a mounting structure for attachment to heat sinks. This multi-functionality improves heat dissipation without proportionally increasing device complexity
Solution Approach 2:
The metallic shell is designed as a thin-walled structure that provides effective thermal conduction while maintaining a compact form factor. The thin-walled design minimizes the increase in device complexity and size while still achieving the desired heat dissipation improvement
3Temperature
If the thickness of the epoxy housing is reduced, then thermal conduction is improved, but the device thickness is reduced which may compromise structural integrity and insulation
Solution Approach 1:
The composite structure of epoxy housing with metallic shell attachment provides both the thermal conduction needed for improved heat dissipation and the structural integrity required for mechanical strength and insulation, allowing thin-walled construction without compromising either thermal conduction or structural integrity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively increases thermal performance, preventing hipot test failures and allowing for reduced package thickness by up to 50%, enhancing heat removal and current rating without altering the device footprint or requiring additional isolation, applicable to both through-hole and surface-mountable devices.
Implementation Method 1
a thermally conductive adhesive layer may be located between the metallic shell and the semiconductor package for securing the metallic shell to the semiconductor package
Implementation Method 2
A semiconductor device design featuring a semiconductor package with a thermally conductive adhesive layer and a metallic shell, such as an aluminum clip, encloses the package, allowing for dual-sided heat dissipation
Implementation Method 3
allowing for dual-sided heat dissipation
Implementation Method 4
using a dielectric, thermally conductive epoxy and molding compound to enhance thermal conductivity and dielectric strength
Implementation Method 5
dielectric, thermally conductive epoxy to enhance thermal conductivity and dielectric strength
Data Source
AI summary
A semiconductor device mountable to a substrate is provided. The device includes a semiconductor package having at least one semiconductor die, an electrically conductive attachment region, and a packaging material in which is embedded the semiconductor die and a first portion of the electrically conductive attachment region contacting the die. A metallic shell encloses the embedded semiconductor die and the first portion of the electrically conductive attachment region.