Semiconductor Package Structure for Moisture Sealing and Warpage Control
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Solution Overview
Problem
As semiconductor packages become increasingly compact and light to meet the demand for portable devices, they face challenges in protecting the internal components from moisture, which can lead to reliability issues such as moisture penetration and warpage.
Innovation Solution
The semiconductor package design includes a redistribution structure with insulating layers and molding members made of materials with low moisture absorption, surrounding the semiconductor chips and redistribution patterns to prevent moisture penetration and reduce warpage, while also using conductive pillars for electrical connectivity between structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If semiconductor packages are made compact and light to meet portable device demands, then the volume and weight are reduced, but the protection from moisture penetration becomes insufficient
Solution Approach 1:
The patent implements a nested protective structure where the first molding member surrounds the first semiconductor chip and first redistribution structure, while the second molding member surrounds the second semiconductor chip and second redistribution structure. These nested molding members create multiple protective barriers within the compact package, providing enhanced moisture protection without significantly increasing volume.
Solution Approach 2:
The patent employs composite materials in the molding members that combine low moisture absorption properties with mechanical strength. This allows the package to maintain compact dimensions while achieving sufficient moisture protection through material composition rather than increased size.
2Reliability
If redistribution structures with insulating layers are used to protect internal components, then moisture protection is improved, but the package becomes more susceptible to warpage
Solution Approach 1:
The patent applies different material properties to different parts of the package. The molding members are specifically designed with low moisture absorption properties in the regions most susceptible to moisture penetration, while maintaining overall structural stability. This localized optimization allows moisture protection without compromising structural integrity.
Solution Approach 2:
The patent modifies material parameters by selecting molding materials with specific moisture absorption characteristics and mechanical properties. By carefully controlling the moisture absorption parameter of the molding members, the patent achieves both moisture protection and warpage resistance simultaneously.
3Reliability
If multiple molding members are used to seal insulating layers from moisture, then moisture protection is enhanced, but the manufacturing complexity increases
Solution Approach 1:
The patent divides the protective function into separate molding members - a first molding member for the first semiconductor chip area and a second molding member for the second semiconductor chip area. This segmentation allows each molding member to be optimized independently and simplifies the manufacturing process compared to a single complex molding structure.
Solution Approach 2:
The molding members serve multiple functions simultaneously: they provide moisture protection, structural support, and mechanical protection for the semiconductor chips and redistribution structures. This multi-functionality reduces the need for additional separate components, thereby managing complexity while enhancing protection.
Data Source
AI summary
A semiconductor package includes: a first redistribution structure including a first redistribution pattern and a first redistribution insulating layer at least partially surrounding the first redistribution pattern; a first semiconductor chip disposed on the first redistribution structure; a first molding member at least partially surrounding the first semiconductor chip and the first redistribution structure; a conductive pillar passing through the first molding member; a second redistribution structure disposed on the first molding member and including a second redistribution pattern and a second redistribution insulating layer at least partially surrounding the second redistribution pattern; a second semiconductor chip disposed on the second redistribution structure; and a second molding member at least partially surrounding the second semiconductor chip and the second redistribution structure.