Semiconductor Package Recess Structure for Uniform Molding Fill
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor packages face challenges in ensuring uniform filling of the molding layer, leading to potential reliability issues and defects due to differences in filling speeds between the semiconductor chip and passive element regions.
Innovation Solution
A semiconductor package design featuring a recessed portion on the substrate and a protruding insulating pattern on the edge region, where the passive element vertically overlaps the recessed portion, allowing the molding layer to fill the space between the passive element and the substrate uniformly, thereby controlling the filling speed and eliminating empty spaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a passive element is mounted on the substrate without a recessed portion, then the mounting process is simpler, but the molding layer cannot fill uniformly, creating empty spaces and reducing reliability
Solution Approach 1:
A recessed portion is formed on the substrate surface at the mounting position of the passive element before the passive element is installed. This preliminary structural preparation enables the molding layer to fill uniformly from the beginning, preventing empty spaces and improving filling reliability without adding complex filling processes later.
Solution Approach 2:
The substrate surface is modified by creating a recessed portion that changes the vertical dimension (depth) at the passive element mounting area. This dimensional change allows the molding layer to flow into and fill the recessed space, ensuring uniform filling across different regions of the package while maintaining a planar top surface.
2Manufacturing precision
If the passive element is mounted directly on the substrate surface, then the structure is simpler, but the molding layer fills at different speeds in different regions, causing defects
Solution Approach 1:
The substrate is designed with a local recessed portion only at the passive element mounting region, while other areas maintain their original surface level. This localized structural modification ensures that the molding layer fills at a consistent speed across all regions by providing a uniform filling path, without requiring complex modifications to the entire substrate structure.
3Reliability
If no recessed portion is provided, then the manufacturing process is simpler, but empty spaces remain in the molding layer, reducing package quality
Solution Approach 1:
The recessed portion is formed on the substrate during the substrate fabrication process before passive element mounting. This preliminary action eliminates the need for additional filling process steps or post-filling repairs, thereby improving package quality while maintaining manufacturing simplicity through process integration.
Data Source
AI summary
A semiconductor package includes a substrate including a first surface and a second surface facing each other, a semiconductor chip on the substrate, a passive element disposed spaced apart from the semiconductor chip in a first direction parallel to the first surface of the substrate, and a first insulating pattern on an edge region of the first surface. The substrate includes a recessed portion formed on the first surface, the passive element vertically overlaps the recess portion, and the first insulating pattern protrudes in a second direction perpendicular to the first surface of the substrate.