Semiconductor Package Layout to Avoid Molding Die Interference

Solution Overview

Problem

The integration of a heat sink and sealing resin in conventional semiconductor devices can lead to interference with molding dies, causing deterioration of the molded state due to power leads projecting from the sealing resin.

Innovation Solution

A semiconductor device design where the heat sink and sealing resin are integrated without direct attachment, utilizing a recessed engagement portion on the heat sink for the sealing resin to avoid interference with molding dies, and using a metal clip to connect conductive layers and terminals.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If the heat sink and sealing resin are integrated with each other, then work for attaching the sealing resin to the heat sink is eliminated, but power leads projecting from the sealing resin interfere with the molding die, causing deterioration of the molded state

Engineering Contradiction:

Improveattachment workVSAvoidmolded state

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The power lead is extracted from the sealing resin body by forming it as a protrusion that extends outward. This allows the power lead to be separated from the main sealing resin structure, enabling the sealing resin to be integrally formed with the heat sink while the power lead protrudes to connect external terminals without interfering with the molding die during the molding process.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The power lead is positioned in a different spatial dimension by extending it as a protrusion from the sealing resin surface. This dimensional arrangement allows the power lead to connect external terminals while being positioned away from the molding die area, thus avoiding interference during the molding process while maintaining integral formation with the heat sink.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Ease of operation

If power leads are allowed to project from the sealing resin for external connection, then electrical connection is enabled, but the projecting power leads interfere with the molding die during the molding process

Engineering Contradiction:

Improveelectrical connectionVSAvoidmolded state

Core Design Contradiction:

Ease of operationVSManufacturing precision

Solution Approach 1:

The power lead is extracted from the sealing resin body by forming it as a protrusion that extends outward. This allows the power lead to be separated from the main sealing resin structure, enabling the sealing resin to be integrally formed with the heat sink while the power lead protrudes to connect external terminals without interfering with the molding die during the molding process.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The power lead is positioned in a different spatial dimension by extending it as a protrusion from the sealing resin surface. This dimensional arrangement allows the power lead to connect external terminals while being positioned away from the molding die area, thus avoiding interference during the molding process while maintaining integral formation with the heat sink.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design ensures seamless integration of the heat sink and sealing resin, preventing molding die interference and maintaining the integrity of the semiconductor device's structure while enhancing heat dissipation.

Implementation Method 1

a heat sink; a base material mounted on the heat sink

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

This can improve heat dissipation of the semiconductor device

Methodology Applied

Scientific EffectConvection: Convection

Data Source

PatentUS20260053054A1Semiconductor device, method for manufacturing semiconductor device, and vehicle

Publication Date: 2026.02.19 ROHM CO LTD

AI summary

A semiconductor device includes a heat sink, a base material including an insulating layer and mounted on the heat sink on one side in a first direction, a first conductive layer bonded to the base material and located on a side opposite the heat sink with respect to the base material, a first semiconductor element bonded to the first conductive layer, a first power terminal electrically connected to the first conductive layer and the first semiconductor element, and a sealing resin covering the first conductive layer and the first semiconductor element. The first power terminal is exposed from the sealing resin. The first power terminal is surrounded by a peripheral edge of the sealing resin as viewed in the first direction.