Semiconductor Package Heat Release Post Molding Uniformity
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Solution Overview
Problem
In semiconductor packaging, the non-uniform pressurization by mold dies due to heat release posts leads to contamination of substrates by molding resin, affecting stability and reliability.
Innovation Solution
The semiconductor package design includes heat release posts on the substrates with extended exposure and specific mold distances greater than post distances, allowing the molding die to directly and uniformly compress areas without heat release posts, using penetration and non-penetration lines to prevent resin overflow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If mold dies press only edges of heat release metal layers by avoiding heat release posts, then the package housing is formed, but the pressurization is not uniform and molding resin overflows toward the heat release metal layers causing substrate contamination
Solution Approach 1:
The mold die pressing surface is segmented into multiple independent pressing regions corresponding to different substrate areas. Each pressing region can apply pressure independently, allowing the mold die to press both heat release metal layers and substrates uniformly without interference from heat release posts.
Solution Approach 2:
A pressing assistance structure is introduced as an intermediary between the mold die and the substrate. This structure includes pressing assistance protrusions that extend into the molding resin to provide additional pressing force directly on the substrate, ensuring uniform compression and preventing resin overflow.
2Temperature
If heat release posts are present on substrates, then heat dissipation is improved, but the molding die cannot uniformly compress the substrates leading to resin overflow
Solution Approach 1:
The mold die is designed with different pressing characteristics for different regions. Pressing assistance protrusions are strategically positioned to provide enhanced local pressing force in areas where heat release posts create pressure gaps, ensuring uniform overall compression while maintaining the heat dissipation function of the posts.
Solution Approach 2:
The pressing assistance protrusions are pre-positioned in the mold die design to anticipate and compensate for the pressure distribution issues caused by heat release posts. This preliminary configuration ensures uniform pressing force distribution from the beginning of the molding process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design prevents substrate contamination and ensures stable molding by uniformly compressing the substrates, improving the quality and reliability of the semiconductor package.
Implementation Method 1
the molding die directly and uniformly compresses an upper substrate and/or a lower substrate
Data Source
AI summary
Provided is a semiconductor package and a method of manufacturing the same, wherein in the semiconductor package, an area on a surface of a heat release metal layer pressed by a molding die is expanded and the molding die directly and uniformly compresses an upper substrate and/or a lower substrate, each of which does not include heat release posts so that contamination of a substrate occurring due to a molding resin may be prevented and molding may be stably performed.