Semiconductor Package Multilayer Isolated Structure for EMI Shielding
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Solution Overview
Problem
Conventional RF modules experience electromagnetic interference (EMI) among semiconductor components despite having metal shielding, highlighting a need for enhanced shielding within the package structure.
Innovation Solution
A semiconductor package design featuring a substrate with semiconductor components, an encapsulant with grooves, and a metal layer that forms a multilayer isolated structure, including metal and air layers, to effectively shield EMI between package units.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a metal thin film covers the periphery of the encapsulant to shield from external EMI, then external electromagnetic interference is blocked, but electromagnetic interference among inner semiconductor components still occurs
Solution Approach 1:
The encapsulant is divided into multiple partitioned regions through grooves that extend from the top surface to the bottom surface, creating isolated compartments for different semiconductor components. This segmentation prevents electromagnetic interference between components while maintaining external shielding coverage.
Solution Approach 2:
The metal thin film is formed not only on the external periphery of the encapsulant but also within the grooves and on the partitioned regions, creating a nested shielding structure where internal metal layers complement the external shielding to block both external and internal EMI.
2Object-generated harmful factors
If grooves are formed in the encapsulant to partition substrate into package units, then internal EMI is reduced through isolation, but the structural integrity and protection of semiconductor components may be compromised
Solution Approach 1:
The encapsulant combines the partitioning function of grooves with the reinforcing function of metal thin film deposited on the groove surfaces and partitioned regions. This composite structure maintains structural integrity while achieving EMI isolation through the grooves.
Solution Approach 2:
The metal thin film is selectively deposited on specific regions such as groove surfaces and partitioned regions where EMI shielding is most needed, rather than uniformly across the entire encapsulant. This localized approach provides targeted EMI protection while minimizing impact on overall structural integrity.
3Object-affected harmful factors
If a metal layer is formed on the substrate and encapsulant to encapsulate periphery of package units, then EMI shielding is enhanced, but manufacturing complexity increases
Solution Approach 1:
The grooves are formed in the encapsulant before the metal thin film is deposited. This preliminary structuring allows the metal deposition process to target specific regions automatically, simplifying the overall manufacturing process while achieving enhanced EMI shielding in critical areas.
Solution Approach 2:
The metal thin film serves multiple functions simultaneously: it provides EMI shielding on external surfaces, reinforces the structural integrity of groove regions, and creates conductive paths for grounding. This multi-functionality reduces the need for separate components or processes.
Data Source
AI summary
A semiconductor package is provided, including: a substrate having opposing first and second surfaces; a plurality of semiconductor components disposed on and electrically connected to the first surface; an encapsulant encapsulating the first surface and the semiconductor components and having at least one first groove that partitions the substrate into a plurality of package units, each of which has at least one of the semiconductor components; and a metal layer formed on the substrate and the encapsulant and encapsulating a periphery of the package units, with the second surface exposed from the metal layer, wherein the metal layer is formed along a wall surface of the first groove, to form a second groove corresponding in position to the first groove and having a metal surface. Therefore, the package units are isolated and form a multilayer isolated structure, including metal layers and air layers, and are electromagnetically shielded from one another.