Semiconductor Package Multilayer Thin Film Structure Substrate Removal
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Solution Overview
Problem
Conventional semiconductor packages with substrates limit miniaturization, increase signal delay due to long interconnection lengths, and are inefficient for high-speed operations and mass production, especially in developing small or stacked communication and electronic devices.
Innovation Solution
A semiconductor package with a multilayer thin film structure, including dielectric layers and redistribution layers, where the semiconductor chip is directly bonded without a substrate, allowing for short interconnections, easy stacking, and simplified mass production by forming packages at the wafer or carrier level.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Weight of moving object
If a substrate with predetermined thickness is used for the package, then the package has structural support, but the package thickness cannot be reduced and weight increases
Solution Approach 1:
The patent removes the traditional substrate from the package structure entirely, extracting only the essential support functions and replacing them with a thin film structure. This eliminates the need for a thick substrate while maintaining structural integrity, directly reducing both package thickness and weight.
Solution Approach 2:
The patent employs a thin film structure as the package support, replacing the rigid thick substrate with a flexible thin film that provides necessary mechanical support. This thin film approach enables significant reduction in package thickness and weight while maintaining structural functionality.
2Volume of moving object
If a substrate with predetermined thickness is used for the package, then the package has structural support, but the size of the whole package cannot be reduced
Solution Approach 1:
By removing the substrate entirely and retaining only the thin film structure for support, the patent achieves compact packaging with reduced volume while maintaining necessary structural support.
Solution Approach 2:
The patent transitions from a three-dimensional substrate-based structure to a more planar, thin-film-based structure, effectively reducing the thickness dimension while maintaining area and volume efficiency.
3Ease of manufacture
If wire bonding is used for electrical interconnection, then the package is easy to manufacture, but signal delay increases and distortion occurs during high-speed operation
Solution Approach 1:
The patent removes the wire bonding process from the manufacturing sequence, eliminating the associated signal delay and distortion problems while maintaining ease of manufacture through alternative interconnection methods.
Solution Approach 2:
The patent replaces the mechanical wire bonding process with a thin-film-based electrical interconnection system that provides shorter signal paths and reduced inductance, improving high-speed signal transmission while maintaining manufacturability.
4Adaptability or versatility
If conventional BGA package technology is used, then the package structure is established, but diverse stacked packages cannot be realized and mass production efficiency is limited
Solution Approach 1:
The thin film structure serves multiple functions simultaneously: structural support, electrical interconnection, and stacking interface. This multi-functionality enables diverse stacked package configurations while maintaining manufacturing efficiency through a universal platform.
Solution Approach 2:
The patent segments the package into modular thin-film layers that can be independently fabricated and then stacked, enabling versatile package configurations while maintaining high production efficiency through standardized modular components.
Data Source
AI summary
There is provided a semiconductor package comprising: a multilayer thin film structure including a plurality of dielectric layers and at least one or more redistribution layers; a semiconductor chip positioned at one side of the multilayer thin film structure and electrically connected to the redistribution layer; and a solder bump formed at the other side of the multilayer thin film structure. The multilayer thin film structure functions as the substrate for the semiconductor package and realizes the light, thin, short and small BGA package without any additional substrate. A plurality of the packages can be simultaneously formed at wafer level or carrier level, to simplify the process and to be favorable for mass production. After the semiconductor chips are formed at wafer level, only the semiconductor chips having the excellent operation characteristic through the test are selectively bonded to the multilayer thin film structure, to provide the high quality package products in which the fault rate is maximally reduced. The light, thin, short and small BGA package according to the present invention enables small and slim communication devices, displayers and other diverse electronic devices, to be contributed to the increase of the competitiveness of the products to which the BGA package is applied.