Semiconductor Package Non-Contact Housing Temperature Detection

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Solution Overview

Problem

Conventional dynamic thermal management (DTM) tools in semiconductor packages often incorrectly stop chip operations due to inaccurate housing temperature detection, leading to reduced efficiency as they rely on assumptive safety temperatures rather than actual housing temperatures, causing unnecessary shutdowns even when chip temperatures are within safe limits.

Innovation Solution

Incorporating a non-contact temperature detection system, such as an infrared ray responsive thermocouple, to directly measure the housing temperature without physical contact, allowing for accurate temperature control of semiconductor chips based on both chip and housing temperatures.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If a non-contact temperature detector is added to directly measure housing temperature, then temperature detection precision is improved, but device complexity increases

Engineering Contradiction:

Improvehousing temperature detection precisionVSAvoidtemperature detection system complexity

Core Design Contradiction:

Measurement precisionVSDevice complexity

Solution Approach 1:

The patent replaces the conventional contact-based temperature detection method with a non-contact infrared temperature detector. This substitution eliminates the need for physical contact between the detector and housing, allowing direct measurement of housing temperature without mechanical interference or thermal conduction requirements, thereby improving measurement precision while maintaining system simplicity

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent introduces an infrared detector as an intermediary device that measures housing temperature through thermal radiation without direct contact. This intermediary approach allows accurate temperature measurement of the housing while avoiding the complexity of direct contact measurement systems, resolving the contradiction between precision and complexity

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If DTM tool uses assumptive safety temperature by adding experimental safety temperature to chip temperature, then reliability is improved, but productivity deteriorates due to unnecessary operation stops

Engineering Contradiction:

Improvethermal management reliabilityVSAvoidchip operation efficiency

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

The patent implements a feedback mechanism where the DTM tool continuously monitors both chip temperature and housing temperature through dedicated detectors. This real-time feedback allows the system to make accurate decisions about chip operation based on actual thermal conditions rather than assumptive values, preventing unnecessary shutdowns while maintaining reliability

Inventive Principle:

Principle #23Feedback

Solution Approach 2:

The patent performs preliminary temperature measurement of the housing using a non-contact detector before making thermal management decisions. By obtaining accurate housing temperature data in advance, the system can determine whether chip operation should continue without relying on conservative safety margins, thus maintaining productivity while ensuring reliability

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach minimizes unnecessary chip operation stops and increases efficiency by enabling precise thermal management based on actual housing and chip temperatures, optimizing performance and reliability in semiconductor packages.

Implementation Method 1

a non-contact temperature detector detecting a temperature of the housing without making contact with the housing

Methodology Applied

Scientific EffectInfrared radiation: Infrared Radiation

Implementation Method 2

an infrared ray (IR) responsive thermocouple generating an electromotive force by absorbing infrared radiant heat emitted from the external heat source

Methodology Applied

Scientific EffectInfrared radiant heat absorption: Absorption (EM radiation)

Implementation Method 3

an infrared ray (IR) responsive thermocouple generating an electromotive force by absorbing infrared radiant heat

Methodology Applied

Scientific EffectThermocouple effect: Thermocouple

Data Source

PatentUS9666503B2Semiconductor package and electronic system including the same

Publication Date: 2017.05.30 SAMSUNG ELECTRONICS CO LTD

AI summary

A semiconductor package and an electronic system including the same include a package board having an electric circuit pattern. A semiconductor chip is mounted on the package board and electrically connected with the circuit pattern of the package board. A non-contact temperature detector is provided with the semiconductor package and detects a temperature of an external heat source without making contact with the external heat source. A temperature controller controls the semiconductor chip according to the temperature of the external heat source that is detected by the non-contact temperature detector.