Semiconductor Package Opening for Direct Pad Connection
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Solution Overview
Problem
Conventional semiconductor devices, such as BGA type semiconductor devices, face manufacturing complexity and cost increase due to their complex structure, reliability issues due to small contact areas between wirings, and potential slanting or missetting during mounting, which can affect the performance of devices like CCDs, leading to image blur and reduced reliability.
Innovation Solution
A semiconductor device with a semiconductor die having a pad electrode on its top surface, a supporting member or resin layer, and an opening for electrical connection to a circuit board's external electrode, simplifying the manufacturing process and enhancing reliability by reducing the risk of slanting and protecting the top surface from mechanical damage and moisture.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional BGA type semiconductor device structure is used, then electrical connection between semiconductor die and circuit board is achieved, but the manufacturing process becomes complex and manufacturing cost increases
Solution Approach 1:
The invention extracts and eliminates the complex first wiring structure and its associated manufacturing steps from the conventional BGA device. By using a simplified support substrate with opening structure instead of the complex glass substrate with first wiring, the patent reduces manufacturing process complexity while maintaining electrical connection functionality between the semiconductor die and circuit board
Solution Approach 2:
The invention segments the device into distinct functional components: a support substrate with openings, a semiconductor die, and bonding wires. This segmentation allows each component to be optimized independently and simplifies the overall manufacturing process by eliminating the need for complex integrated wiring structures within a single glass substrate
2Ease of manufacture
If ball-shaped conductive terminals are used for mounting, then electrical connection is achieved, but slanting or missetting occurs during mounting
Solution Approach 1:
Instead of using ball-shaped conductive terminals that require compression bonding (which causes slanting), the invention inverts the approach by using a support substrate with openings that allow direct electrical connection. This inverted structure enables the semiconductor die to be mounted without the slanting and missetting problems associated with ball-terminal compression bonding
Data Source
AI summary
The invention provides a package type semiconductor device and a manufacturing method thereof where reliability is improved without increasing a manufacturing cost. A resin layer and a supporting member are formed on a top surface of a semiconductor substrate formed with pad electrodes. Then, openings are formed penetrating the resin layer and the supporting member so as to expose the pad electrodes. Metal layers are then formed on the pad electrodes exposed in the openings, and conductive terminals are formed thereon. Finally, the semiconductor substrate is separated into semiconductor dice by dicing. When this semiconductor device is mounted on a circuit board (not shown), the conductive terminals of the semiconductor die and external electrodes of the circuit board are electrically connected with each other.