Semiconductor Package Optical Structure Protection
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Solution Overview
Problem
Semiconductor package structures are vulnerable to dust and particles that can adversely affect their performance, particularly in environmental conditions such as extreme temperatures and humidity, leading to potential damage to the optical structures and conductive wires.
Innovation Solution
The semiconductor package structure incorporates a carrier, an electronic device, a spacer, a transparent panel, and conductive wires, with the spacer enclosing the optical structure and the transparent panel hermetically sealed to protect it from external particles, while the conductive wires are designed to be stress-free and exposed to air to withstand environmental changes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the optical structure is exposed to the external environment, then the semiconductor device can detect environmental conditions, but dust and particles can adversely affect performance
Solution Approach 1:
The package structure is divided into a sealed enclosure containing the optical structure and a window region that allows environmental exposure. This segmentation enables the optical structure to be protected from particles while still permitting environmental detection through the window, resolving the contradiction between exposure and protection.
Solution Approach 2:
The window structure acts as an intermediary between the external environment and the optical structure. It allows light and environmental conditions to pass through for detection while blocking dust and particles from reaching the optical structure, thus maintaining both detection capability and protection.
2Ease of operation
If conductive wires are exposed to air for electrical connection, then electrical connectivity is achieved, but stress from environmental changes can damage the wires
Solution Approach 1:
The conductive wires are enclosed within a flexible or stress-absorbing protective structure that allows for environmental expansion and contraction without transmitting damaging stress to the wires. This maintains electrical connectivity while protecting wire integrity during heat operations and environmental changes.
3Object-affected harmful factors
If the semiconductor device is hermetically sealed to protect from particles, then protection from dust is achieved, but the 'popcorn effect' can occur during heat operations
Solution Approach 1:
The sealed enclosure is segmented to include a window region and is designed with controlled expansion pathways. This segmentation allows the structure to accommodate thermal expansion during heat operations without building up excessive internal pressure that would cause the popcorn effect, while maintaining protection from particle contamination.
Solution Approach 2:
The package structure incorporates stress-absorbing elements and expansion accommodation features beforehand to cushion against thermal expansion stresses. This prevents the sudden structural failure known as the popcorn effect during heat operations while maintaining the hermetic seal for particle protection.
Data Source
AI summary
A semiconductor package structure includes a carrier, an electronic device, a spacer, a transparent panel, and a conductive wire. The electronic device has a first surface and an optical structure on the first surface. The spacer is disposed on the first surface to enclose the optical structure of the electronic device. The transparent panel is disposed on the spacer. The conductive wire electrically connects the electronic device to the carrier and is exposed to air.