Semiconductor Package Passive Element Rotation Prevention
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Solution Overview
Problem
Semiconductor packages face challenges in preventing the rotation of passive elements, which can lead to electrical shorts and reduced yield, while also aiming to minimize volume and enhance manufacturing efficiency.
Innovation Solution
The semiconductor package design includes a substrate with exposed passive element pads and dams that extend downwardly, allowing the passive element to be positioned between the dams, maintaining electrical connection while preventing rotation beyond a certain angle, thus preventing electrical shorts and optimizing package volume.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the passive element is mounted on the substrate without rotation prevention structure, then the manufacturing process is simple, but the passive element may rotate during assembly causing electrical shorts and reduced yield
Solution Approach 1:
The rotation prevention structure is divided into multiple dams (first dam, second dam, third dam, fourth dam) positioned at different locations around the passive element. Each dam segment provides localized rotation prevention, collectively ensuring the passive element cannot rotate beyond a predetermined angle while maintaining electrical connection between pads.
Solution Approach 2:
The dams act as intermediary structures between the passive element and the substrate. These dams physically intervene to prevent direct rotation of the passive element on the substrate surface, thereby preventing electrical shorts without requiring complex locking mechanisms.
2Reliability
If the passive element is positioned to ensure electrical connection between pads, then electrical reliability is improved, but the passive element may still rotate beyond acceptable angles causing shorts
Solution Approach 1:
The dams are pre-positioned on the substrate before the passive element is mounted. These dams create predetermined restrictions that prevent the passive element from rotating beyond a specific angle, thereby preemptively preventing electrical shorts before they can occur during assembly or operation.
Solution Approach 2:
The rotation prevention dams are formed as part of the substrate structure before passive element mounting. This preliminary structuring ensures that when the passive element is placed and electrically connected, it is simultaneously constrained within acceptable rotation angles, preventing harmful rotation-induced shorts.
3Stability of the object's composition
If rotation prevention structures are added to the substrate, then passive element stability is improved, but the total package volume increases
Solution Approach 1:
The rotation prevention dams are localized structures positioned only in specific areas around the passive element where rotation control is needed. Rather than adding a comprehensive rotation prevention mechanism across the entire substrate, the dams are concentrated locally, minimizing volume increase while ensuring stability.
Solution Approach 2:
The dams extend in the thickness direction of the substrate, utilizing the vertical dimension rather than only the planar surface area. This allows rotation prevention functionality to be achieved by adding height to existing substrate areas rather than expanding the package footprint, thereby maintaining compact overall volume.
Data Source
AI summary
A semiconductor package includes a substrate having a first surface and a second surface opposite to the first surface. A semiconductor chip is on the first surface of the substrate. A passive element is on the second surface of the substrate. The substrate includes a first passive element pad and a second passive element pad that are exposed by the second surface. A dam extends downwardly from the second surface. The dam includes a first dam and a second dam. The passive element is disposed between the first dam and the second dam. The passive element includes a first electrode portion electrically connected to the first passive element pad. A second electrode portion is electrically connected to the second passive element pad.