Semiconductor Package Power-Up Delay via Conductive Paste
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Solution Overview
Problem
The existing semiconductor packages experience significant power-up delays due to the native aluminum oxide layer on the Si spacer, which acts as a dielectric capacitor, and previous attempts to mitigate this issue, such as plasma cleaning and increasing the conductive paste area, have not achieved consistent start-up times across power-up cycles.
Innovation Solution
The semiconductor package design includes a stacked arrangement of electronic components separated by a silicon spacer coated with aluminum, where the uppermost component is connected to conductive wires using a conductive paste layer that embeds one end of the wire, effectively bypassing the spacer's capacitance effect by routing electrical signals directly through the paste layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a silicon spacer coated with aluminum is used to separate stacked electronic components, then mechanical support and electrical isolation are provided, but the native aluminum oxide layer on the spacer acts as a dielectric capacitor causing substantial time delay during first power-up
Solution Approach 1:
The patent extracts the harmful capacitive effect by removing the aluminum oxide dielectric layer from the spacer surface through plasma cleaning or chemical etching processes, eliminating the source of power-up delay while preserving the spacer's mechanical support function
Solution Approach 2:
The patent introduces a conductive paste as an intermediary material between the electronic component and the spacer, replacing the insulating aluminum oxide layer with a conductive pathway that eliminates capacitive effects while maintaining mechanical attachment
2Loss of time
If plasma cleaning or increased conductive paste area is used to remove the aluminum oxide layer, then the capacitive effect is reduced, but consistent start-up times across all power-up cycles are not achieved
Solution Approach 1:
The patent changes the physical-chemical parameters of the spacer surface by controlling the thickness and conductivity of the aluminum coating through sputtering or evaporation processes, and by precisely controlling the conductive paste composition and application parameters to achieve optimal electrical contact that eliminates capacitive effects consistently across all power-up cycles
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures consistent start-up delay parameters across power-up cycles, eliminating the adverse impact of the spacer's capacitance and achieving acceptable start-up times comparable to subsequent cycles.
Implementation Method 1
the electrical connection of at least one of the conductive wires to the uppermost electronic component of the stack being facilitated by the use of a conductive paste
Implementation Method 2
The native aluminum oxide layer is typically in the thickness range of from about ten to fifty angstroms. It is been determined that the aluminum oxide layer of the spacer acts as a dielectric layer of a capacitor
Implementation Method 3
a specific type of semiconductor package which comprises a substrate having a first electronic component such as an integrated circuit attached to the top surface thereof. Attached to the top surface of the integrated circuit is a spacer which is fabricated from Si coated with aluminum
Data Source
AI summary
In accordance with the present invention, there is provided multiple embodiments of a semiconductor package including at least two electronic components which are provided in a stacked arrangement, and are each electrically connected to an underlying substrate through the use of conductive wires. In accordance with one embodiment of the present invention, the electronic components are separated from each other by an intervening spacer which is typically fabricated from aluminum, or from silicon coated with aluminum. In this particular embodiment, the uppermost electronic component of the stack is electrically connected to at least one of the conductive wires through the use of a conductive paste layer which is also used to secure the uppermost electronic component to the underlying spacer. In this regard, one end of one of the conductive wires may be embedded in the conductive paste layer adjacent one side of the uppermost electronic component, or between the bottom surface of such electronic component and the spacer.