Semiconductor Package Pattern Walls for Compact Reliable Interconnects
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Solution Overview
Problem
Existing semiconductor packages face issues such as excess cost, decreased reliability, relatively low performance, and large package sizes, which are not adequately addressed by conventional manufacturing methods.
Innovation Solution
The proposed solution involves a semiconductor device and method for manufacturing, which includes a substrate with a dielectric and conductive structure, an electronic component, and an encapsulant. The dielectric structure features pattern bases and walls that extend from the pattern base and are adjacent to the conductive terminal, providing structural support and electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional semiconductor packaging methods are used, then manufacturing simplicity is maintained, but package size becomes too large
Solution Approach 1:
The semiconductor device is divided into distinct functional segments: a substrate containing circuit elements, a dielectric structure with patterned walls and bases, conductive structures for electrical connection, and an encapsulant for protection. This segmentation allows each component to be optimized independently, reducing overall package size while maintaining manufacturing feasibility through modular assembly processes.
Solution Approach 2:
The dielectric structure incorporates vertical pattern walls that extend upward from the substrate surface, creating a three-dimensional arrangement of conductive and dielectric elements. This vertical dimensionality allows for higher density integration and smaller footprint compared to conventional planar packaging, enabling reduced package size without proportionally increasing manufacturing complexity.
2Reliability
If conventional packaging structures are used, then manufacturing cost is controlled, but reliability decreases
Solution Approach 1:
The dielectric structure with pattern walls and pattern bases is formed prior to final assembly, establishing precise structural boundaries and electrical isolation pathways in advance. This preliminary structuring ensures reliable electrical connections and mechanical support are built-in from the outset, improving package reliability while using cost-effective standard fabrication processes.
Solution Approach 2:
The patterned dielectric structure serves as an intermediary element between the substrate circuit elements and the encapsulant, providing both mechanical support and electrical isolation. This intermediate dielectric layer with its patterned walls and bases ensures reliable signal routing and protection without requiring complex direct connections, thereby improving reliability at moderate manufacturing cost.
3Reliability
If conventional packaging is used, then manufacturing process is simple, but performance is relatively low
Solution Approach 1:
The dielectric structure features locally optimized regions including pattern walls in specific locations and pattern bases at particular positions, each tailored to provide specific electrical and mechanical properties where needed. This local quality optimization enhances device performance by providing targeted electrical isolation, mechanical support, and signal routing without requiring complex structures throughout the entire device.
Solution Approach 2:
The semiconductor device employs a composite structure combining substrate material, dielectric material with patterned geometry, conductive materials, and encapsulant material. Each material is selected and positioned to provide specific functional properties, creating a composite system that achieves superior overall performance compared to conventional homogeneous packaging structures.
4Area of stationary object
If conventional packaging methods are used, then manufacturing cost is controlled, but package size becomes too large
Solution Approach 1:
The substrate, dielectric structure, conductive elements, and encapsulant are merged into an integrated assembly where the dielectric pattern walls and bases are formed as part of the substrate structure rather than as separate components. This merging eliminates the need for additional assembly steps and reduces overall package area while maintaining ease of manufacture through integrated fabrication processes.
Data Source
AI summary
In one example, a semiconductor device comprises a substrate comprising a top side and a bottom side, a dielectric structure, and a conductive structure, wherein the conductive structure comprises a first terminal exposed from the dielectric structure, an electronic component over the top side of the substrate, and an encapsulant over the top side of the substrate and covering a lateral side of the electronic component. The dielectric structure comprises a first pattern base and first pattern wall that extends from the first pattern base and is adjacent to the first terminal, and the first terminal is bounded by the first pattern wall. Other examples and related methods are also disclosed herein.