Semiconductor Package With Permanent Carrier And Cap
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Solution Overview
Problem
Current fan-out semiconductor packaging solutions require high capital investment for new equipment and facilities, and existing technologies struggle to produce thin packages with high I/O counts, multi-level redistribution layers, and enhanced heat dissipation using existing equipment.
Innovation Solution
The method involves forming semiconductor packages by attaching dies to a permanent carrier and encapsulating them with a cap, where the cap's surface is disposed at a different plane than the die's surface, allowing for the use of existing equipment and enabling thin profiles, high I/O counts, and multi-level redistribution layers, while also providing enhanced heat dissipation through a rigid carrier that remains part of the package.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional fan-out packaging solutions are used, then semiconductor packages can be produced, but high capital investment is required for new equipment and facilities
Solution Approach 1:
The permanent carrier serves multiple functions: it provides mechanical support for the die during packaging, acts as a heat dissipation path, and enables the die to be processed using existing equipment. This multi-functionality eliminates the need for specialized new equipment while achieving the same packaging results.
Solution Approach 2:
The die is attached to the permanent carrier in a configuration where the carrier itself provides the necessary support and heat dissipation functions, eliminating the need for additional specialized facilities or equipment. The existing packaging equipment can directly process this structure without modification.
2Length of stationary object
If thin package profiles are desired, then package size is reduced, but achieving high I/O counts and multi-level redistribution layers becomes difficult
Solution Approach 1:
The permanent carrier enables redistribution layers to be formed in the horizontal plane rather than requiring vertical stacking, allowing high I/O counts to be achieved within a thin profile by utilizing the carrier's surface area for multi-level routing.
3Temperature
If enhanced heat dissipation is required, then thermal management is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The permanent carrier simultaneously provides mechanical support, structural stability, and heat dissipation functions. The carrier's thermal properties are utilized to conduct heat away from the die, eliminating the need for separate heat dissipation components and simplifying the overall package structure.
4Quantity of substance
If existing equipment is used, then capital investment is reduced, but manufacturing precision and capability are limited
Solution Approach 1:
The permanent carrier is designed with specific dimensional parameters and material properties that enable existing equipment to achieve the required precision. The carrier's rigidity and dimensional stability compensate for any limitations in the existing equipment's precision capabilities.
Data Source
AI summary
Semiconductor packages and methods of forming a semiconductor package are disclosed. The method includes providing at least one die having first and second surfaces. The second surface of the die includes a plurality of conductive pads. A permanent carrier is provided and the at least one die is attached to the permanent carrier. The first surface of the at least one die is facing the permanent carrier. A cap having first and second surfaces is formed to encapsulate the at least one die. The first surface of the cap contacts the permanent carrier and the second surface of the cap is disposed at a different plane than the second surface of the die.