Semiconductor Package with Integrated Permeable Element and Coil
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current NFC devices face challenges in improving communication quality and reducing package size, particularly for passive RFID devices that require sufficient power to operate and transmit information over increased distances, while also minimizing interference from magnetic fields.
Innovation Solution
A semiconductor package device is designed with a substrate, a magnetically permeable element, and a coil, where the coil is integrated within the package to enhance power reception and transmission capabilities, and the permeable element is structured to aggregate magnetic fields and reduce interference with electronic components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the package size is reduced, then the portability and integration of NFC devices is improved, but the power reception capability and communication quality deteriorate
Solution Approach 1:
The patent combines the coil and magnetically permeable element into a single integrated antenna structure within the semiconductor package. This merging allows the antenna to function efficiently within a reduced package volume while maintaining power reception capability through the synergistic interaction between the coil and magnetic elements.
Solution Approach 2:
The patent optimizes the physical and electrical parameters of the antenna structure, including the geometry of the coil, the magnetic permeability of the elements, and their spatial arrangement. These parameter changes enable enhanced power reception within a compact form factor by maximizing the magnetic coupling efficiency.
2Length of moving object
If the communication distance is increased, then the usability of NFC devices is improved, but the interference from magnetic fields increases
Solution Approach 1:
The patent converts the potentially harmful magnetic field interference into a beneficial effect by using magnetically permeable elements that aggregate and direct magnetic field lines. These elements focus the magnetic flux through the coil, enhancing the magnetic coupling between transmitter and receiver while shielding sensitive electronic components from disruptive magnetic interference.
Solution Approach 2:
The magnetically permeable elements act as intermediaries between the external magnetic field and the coil antenna. They mediate the magnetic field distribution by concentrating flux where needed for power transfer while directing harmful interference away from sensitive electronic components, thus enabling extended communication distance with reduced interference.
3Ease of manufacture
If the coil is integrated within the package, then the manufacturing cost and device size are reduced, but the complexity of magnetic field management increases
Solution Approach 1:
The patent applies local quality by positioning magnetically permeable elements at specific locations around the coil where magnetic field concentration is most beneficial. This localized approach to magnetic field management optimizes power reception and interference shielding without requiring complex global magnetic shielding structures, thus maintaining manufacturing simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves the communication quality and power reception of NFC devices, allowing them to operate effectively at greater distances and reduces the overall size and manufacturing costs of the device by integrating the wireless charging coil, while minimizing interference from magnetic fields.
Implementation Method 1
the permeable element is structured to aggregate magnetic fields and reduce interference with electronic components
Implementation Method 2
a coil disposed on the substrate and surrounding the second portion of the permeable element
Data Source
AI summary
A semiconductor package device includes: (1) a substrate having a first surface; (2) a permeable element including a first portion disposed on the first surface of the substrate, a second portion protruding from the first portion, and a third portion disposed on the second portion and contacting the second portion of the permeable element; (3) a first electrical element disposed on the substrate and surrounded by the second portion of the permeable element; and (4) a coil disposed on the substrate and surrounding the second portion of the permeable element.