Semiconductor Package Thermal Management with Phase Change Molding
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Solution Overview
Problem
Semiconductor packages face challenges in thermal stability due to inadequate heat dissipation, especially in miniaturized multi-function electronic products, which can lead to errors from accumulated heat.
Innovation Solution
Incorporating a semiconductor package design with a substrate, semiconductor chip, molding, and heat dissipation member, where the molding includes phase change materials and thermally conductive particles to enhance heat dissipation, and additional temperature control members in various forms and locations to manage thermal transitions effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If semiconductor packages are miniaturized for multi-function electronic products, then device integration and functionality are improved, but heat dissipation capability deteriorates leading to thermal instability
Solution Approach 1:
The patent incorporates phase change materials (PCMs) into the molding compound that undergo phase transition at specific temperatures (e.g., 40-60°C range). When the semiconductor device generates heat and the PCM reaches its phase transition temperature, it absorbs latent heat during the solid-liquid phase change, effectively regulating the temperature and improving thermal stability in miniaturized multi-function packages.
Solution Approach 2:
The patent uses composite molding compounds that combine thermosetting resin base materials with thermally conductive particles (such as aluminum oxide, aluminum nitride, or boron nitride) and phase change materials. This composite structure provides both the mechanical properties of the resin and the thermal management capabilities of the conductive particles and PCMs, enabling effective heat dissipation in compact designs.
2Temperature
If heat dissipation structures are added to improve thermal stability, then temperature control is improved, but device complexity increases
Solution Approach 1:
The patent merges the thermal management functions directly into the molding compound by incorporating phase change materials and thermally conductive particles during the molding process. This integration eliminates the need for separate heat dissipation components or additional assembly steps, thereby improving heat dissipation efficiency without significantly increasing device complexity.
Solution Approach 2:
The molding compound serves multiple functions simultaneously: it provides mechanical protection for the semiconductor device, acts as a thermal management system through embedded phase change materials and conductive particles, and maintains structural integrity. This multi-functionality reduces the need for additional dedicated heat dissipation components, keeping the package structure relatively simple while achieving effective temperature control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly improves thermal stability and heat dissipation efficiency, maintaining lower temperatures in electronic products over time compared to conventional designs, thereby reducing the risk of errors and enhancing reliability.
Implementation Method 1
the first temperature control member may include a phase change material
Implementation Method 2
the molding may further include a plurality of thermally conductive particles being scattered in the first temperature control member
Data Source
AI summary
Semiconductor package are provided. In one embodiment, the semiconductor package may include a substrate such as a circuit substrate, a semiconductor chip mounted on the circuit substrate, a molding (or an encapsulant) covering the semiconductor chip and the circuit substrate and including a first temperature control member, and a heat dissipation member covering the molding.