Semiconductor Package Pillar Sheath for Dense Redistribution Routing
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Solution Overview
Problem
The semiconductor industry faces challenges in achieving reliable and compact packaging solutions due to the need for smaller electronic components, which require improved integration density and routing capabilities, while maintaining the integrity and protection of conductive pillars during manufacturing processes.
Innovation Solution
The implementation of a complex compound layer formed using an organic compound solution, such as an imidazole derivative, on conductive pillars, followed by a protection layer and a molding compound, enhances adhesion and protection, allowing for efficient planarization and redistribution structures to be formed, thereby supporting the integration and packaging of semiconductor dies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conductive pillars are used for electrical connections in semiconductor packages, then routing capability and integration density are improved, but the conductive pillars are vulnerable to damage and adhesion issues during manufacturing processes
Solution Approach 1:
The patent applies composite materials by forming a complex compound layer comprising multiple materials (e.g., copper, nickel, and other metals or alloys) on the conductive pillar surface. This composite structure provides both electrical conductivity and enhanced mechanical protection, resolving the contradiction between maintaining pillar integrity and achieving high integration density.
Solution Approach 2:
The complex compound layer acts as an intermediary between the conductive pillar and the molding compound. This intermediate layer prevents direct contact between the molding compound and the conductive pillar, eliminating adhesion issues while preserving the electrical connection functionality, thus enabling higher integration density without compromising pillar reliability.
2Area of stationary object
If smaller electronic components are integrated to increase integration density, then package area is reduced, but manufacturing precision and protection requirements increase
Solution Approach 1:
The complex compound layer is formed on the conductive pillars before the molding compound is applied. This preliminary protective action ensures that the conductive pillars are pre-protected against potential damage during subsequent manufacturing steps, enabling precise manufacturing of smaller components without compromising pillar integrity.
3Ease of manufacture
If conventional packaging methods are used, then manufacturing process is simple, but adhesion between molding compound and conductive pillars is poor
Solution Approach 1:
The complex compound layer serves as an intermediary that improves adhesion between the molding compound and the conductive pillar. This intermediate layer provides chemical or physical bonding sites that enhance adhesion strength, while the overall manufacturing process remains relatively simple as it adds only one formation step.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides better adhesion and protection for conductive pillars, enabling reliable integration and packaging of semiconductor dies with improved routing capabilities and compactness, enhancing the overall efficiency and reliability of semiconductor packages.
Implementation Method 1
a complex compound layer covering a top surface and a sidewall of the conductive pillar is formed
Data Source
AI summary
A semiconductor package includes a semiconductor die and a redistribution structure. The semiconductor die is laterally surrounded by a molding compound, and the semiconductor die has a conductive pillar and a complex compound sheath sandwiched between the conductive pillar and the molding compound. The redistribution structure is electrically connected with the semiconductor die and comprises a first via portion at a first side of the redistribution structure and a second via portion at a second side of the redistribution structure, and a base angle of the second via portion is greater than a base angle of the first via portion.