Semiconductor Package Pin Layout for Compact DDR Clock Routing
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Solution Overview
Problem
The rapid update cycles of memory chips require a package structure that can efficiently support various data bit widths, such as 4 bits, 8 bits, and 16 bits, while minimizing the size of the signal pin array and improving signal integrity and latency matching.
Innovation Solution
A package structure with a signal pin array where clock pins and command address pins are arranged in a specific configuration, with clock pins adjacent to command address pins in both column and row directions, reducing the overall size and improving signal transmission paths, and allowing for compatibility with DDR5 and DDR6 chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the signal pin array uses a conventional layout, then the connection between chip and circuit board can be established, but the area occupied by the signal pin array is large and signal transmission latency is high
Solution Approach 1:
The patent transitions from a conventional two-dimensional pin array layout to a three-dimensional stacked configuration where signal pins are arranged across multiple layers. This dimensional change allows signal pins to be positioned closer to the chip in the vertical dimension while maintaining organized signal groups, thereby reducing transmission path length and latency without increasing the horizontal footprint of the pin array.
Solution Approach 2:
The patent implements a nested arrangement where command address pins and clock pins are grouped together in specific patterns, with certain pin types nested within or adjacent to other pin types. This nesting creates compact signal groups that reduce the overall area required while keeping related signals close together for optimized transmission.
2Adaptability or versatility
If the package structure is designed for a specific data bit width, then optimization for that width is achieved, but adaptability to other data bit widths (4 bits, 8 bits, 16 bits) is limited
Solution Approach 1:
The patent designs a universal package structure where the signal pin array configuration can support multiple data bit widths (4 bits, 8 bits, and 16 bits) through a single standardized layout. The pin groups are arranged in a flexible manner that can be configured for different bit widths without requiring fundamental redesign, allowing one package structure to serve multiple memory chip specifications.
Solution Approach 2:
The signal pin array is segmented into modular groups that can be selectively activated or deactivated based on the required data bit width. This segmentation allows the same physical pin array to be configured for 4-bit, 8-bit, or 16-bit operations by enabling appropriate subsets of pins, thereby achieving multi-functionality without increasing structural complexity.
3Productivity
If clock pins and command address pins are arranged separately, then signal routing is simplified, but signal transmission efficiency and latency matching deteriorate
Solution Approach 1:
The patent merges clock pins and command address pins into integrated signal groups where they are positioned adjacent to each other in a coordinated pattern. This merging allows related signals to travel together through the package structure, improving transmission efficiency and enabling better latency matching between clock and command/address signals without significantly complicating the routing architecture.
Data Source
AI summary
A package structure and a semiconductor structure are provided. A package base is included, and a signal pin array is disposed on the surface of the package base; and the signal pin array includes multiple clock pins configured to carry a clock signal and multiple command address pins configured to carry a command address signal, the multiple clock pins are arranged in a first direction, and each of the clock pins is adjacent to one of the command address pins in a second direction.