Semiconductor Package Polishing Stopper for Thickness Stability
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Solution Overview
Problem
The existing technology for sealing semiconductor chips with resin in a Chip Scale Package (CSP) faces issues with thickness variation and warping during polishing, which lowers throughput and reliability.
Innovation Solution
Incorporating a dummy member made of a harder material than the resin and columnar electrodes, which functions as a polishing stopper to maintain consistent thickness and prevent warping by exposing during polishing, allowing for stable package thickness and increased reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the resin is polished to adjust the thickness of the semiconductor package, then the thickness can be controlled, but the thickness varies and the package warps
Solution Approach 1:
A dummy member is embedded in the resin before polishing to serve as a stopper that prevents over-polishing and warping. The dummy member is positioned at a predetermined depth to automatically halt the polishing process at the correct thickness, eliminating the need for continuous monitoring and preventing package deformation.
Solution Approach 2:
The dummy member acts as an intermediary element between the polishing tool and the resin package. It provides a physical reference point that mediates the polishing process, ensuring uniform thickness removal while preventing the resin from being over-polished and warped.
2Manufacturing precision
If the thickness of the resin is measured during polishing to control thickness, then precision is improved, but throughput decreases
Solution Approach 1:
The dummy member enables the polishing process to be self-regulating. The dummy member itself serves as the thickness reference, eliminating the need for external measurement devices or operators to continuously monitor and adjust the polishing depth. The process automatically stops when the dummy member is exposed, achieving precision without reducing throughput.
3Stability of the object's composition
If the resin is polished too much to ensure sufficient thickness, then warping is prevented, but thickness variation increases
Solution Approach 1:
The dummy member is pre-positioned at the exact depth where the resin should be polished to. This preliminary placement ensures that the polishing process stops at the precise moment when the desired thickness is achieved, preventing both over-polishing (which causes warping) and under-polishing (which leaves excessive material).
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution stabilizes the thickness of the semiconductor package, eliminates the need for mid-polishing thickness measurement, and enhances the reliability by preventing warping, thus improving manufacturing efficiency and product reliability.
Implementation Method 1
a dummy member 80 which is surrounded by the insulant 90 and is harder than the columnar electrodes 60 and the insulant 90
Data Source
AI summary
A semiconductor device includes a semiconductor chip having a first face and a second face on an opposite side to the first face, and including semiconductor elements arranged on the first face. Columnar electrodes are arranged above the first face, and electrically connected to any of the semiconductor elements. A first member is located around the columnar electrodes above the first face. An insulant covers the columnar electrodes and the first member. The first member is harder than the columnar electrodes and the insulant. The first member and the columnar electrodes are exposed from a surface of the insulant.