Semiconductor Package Polyimide Film Adhesion

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Solution Overview

Problem

Conventional semiconductor packages face reliability issues due to the separation of resin members from passivation films, leading to open defects caused by poor adhesion and thermal stress, especially when the contact area between the resin and passivation films is large.

Innovation Solution

A semiconductor package design that includes a polyimide film as an organic insulating layer covering the probe marks and unused pads, reducing the contact area between the resin and passivation films, and using a barrier metal layer to protect the pads during chemical processing, thereby enhancing adhesion and preventing damage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the contact area between resin and passivation films is large, then the sealing effect is improved, but the adhesion is poor leading to separation and open defects

Engineering Contradiction:

Improveadhesion between resin and passivation filmsVSAvoidseparation and open defects

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

An organic insulating film is introduced as an intermediary layer between the resin member and the passivation film. This intermediate layer improves adhesion between the resin and passivation film, preventing separation and open defects that occur when the contact area is large. The organic insulating film acts as a mediator that enhances bonding while allowing adequate contact area for sealing.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent uses a composite structure consisting of multiple layers: passivation film, organic insulating film, and resin member. This composite material approach combines the benefits of each layer - the passivation film provides protection, the organic insulating film provides adhesion enhancement, and the resin member provides sealing. The composite structure resolves the contradiction by allowing large contact area while maintaining strong adhesion through the intermediate organic layer.

Inventive Principle:

Principle #40Composite materials

2Reliability

If the contact area between resin and passivation films is reduced, then adhesion is improved, but the sealing effect deteriorates

Engineering Contradiction:

Improveadhesion between resin and passivation filmsVSAvoidsealing effect

Core Design Contradiction:

ReliabilityVSStability of the object's composition

Solution Approach 1:

The organic insulating film serves as an intermediary that enables both large contact area and strong adhesion. It allows the resin member to maintain extensive contact with the underlying structure for sealing while the intermediate organic layer ensures strong bonding, thus resolving the contradiction between contact area and adhesion quality.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent applies different materials with different properties at different locations: the passivation film provides protective properties, while the organic insulating film provides adhesion-enhancing properties. This local differentiation of material qualities allows the system to achieve both large contact area for sealing and strong adhesion to prevent separation.

Inventive Principle:

Principle #3Local quality

3Ease of manufacture

If probe marks and unused pads are left exposed, then manufacturing is simplified, but chemical liquid damages the pads during processing

Engineering Contradiction:

Improvesimplicity of manufacturing processVSAvoidpad integrity during chemical processing

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The organic insulating film is formed in advance to cover the probe marks and unused pads before subsequent chemical processing steps. This preliminary protective action prevents chemical liquid from damaging the pads during manufacturing, while the covering structure is already in place to protect vulnerable areas throughout the manufacturing process.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The organic insulating film acts as an intermediary protective layer between the chemical liquid and the vulnerable probe marks and unused pads. This intermediate barrier prevents direct contact between the chemical liquid and the pads, eliminating damage while maintaining manufacturing simplicity.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design improves the reliability of the semiconductor package by reducing the likelihood of open defects and enhancing the adhesion between the resin and polyimide film, suppressing separation and defect occurrence.

Implementation Method 1

enhancing the adhesion between the resin and polyimide film, suppressing separation

Methodology Applied

Scientific EffectAdhesion: Adhesive

Implementation Method 2

using a barrier metal layer to protect the pads during chemical processing

Methodology Applied

Scientific EffectChemical resistance:

Data Source

PatentUS11476210B2Semiconductor device and semiconductor package

Publication Date: 2022.10.18 KK TOSHIBA

AI summary

A semiconductor device includes: a first semiconductor chip having a first pad and a second pad, a depression being formed in the second pad; an organic insulating film provided on the first semiconductor chip, the organic insulating film covering the depression and not covering at least a portion of the first pad; and a redistribution layer having a lower portion connected to the first pad and an upper portion disposed on the organic insulating film.