Semiconductor Package Polymer Insulation Thermal Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor packages face challenges with high thermal resistivity, complex manufacturing processes, and difficulty in maintaining electrical insulation, particularly in high-voltage power devices, due to the limitations of current insulating substrates like DBC and IMS.
Innovation Solution
A semiconductor package is developed using a lead frame with a polymer layer component made from materials like alumina, aluminum nitride, or boron nitride added to epoxy resin, combined with a copper metal layer, and a method of fabricating this package that includes attaching semiconductor chips and using electric connectors like bonding wire or metal clips for efficient electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a sealing material is used to maintain electrical insulation between the lead frame and heat sink, then electrical insulation is improved, but thermal conductivity deteriorates
Solution Approach 1:
The patent uses a composite structure consisting of a resin layer (for electrical insulation) and a heat dissipation member made of high thermal conductivity material (for thermal conduction). This composite approach allows simultaneous achievement of electrical insulation and thermal conductivity by combining materials with complementary properties in a layered configuration.
2Reliability
If different types of sealing materials are applied on one power semiconductor module package, then electrical insulation and thermal management are improved, but manufacturing process complexity increases
Solution Approach 1:
The patent divides the sealing and heat dissipation function into two separate components: a resin layer for electrical insulation and a heat dissipation member for thermal management. This segmentation allows each component to be optimized independently and simplifies the manufacturing process by enabling separate fabrication and assembly of these components rather than requiring complex multi-material sealing processes.
3Adaptability or versatility
If a plurality of semiconductor chips are mounted on a lead frame, then device functionality is improved, but maintaining electrical insulation between chips becomes difficult
Solution Approach 1:
The patent introduces an insulating substrate as an intermediary layer between multiple semiconductor chips mounted on the lead frame. This insulating substrate provides a standardized insulating barrier that maintains electrical isolation between chips while allowing multiple chips to be mounted, thus enabling enhanced device functionality without compromising electrical insulation reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a semiconductor package with high electrical resistivity and low thermal resistivity, reducing manufacturing costs and improving insulation and thermal dissipation, while maintaining reliable electrical connections.
Implementation Method 1
a polymer layer component on the lead frame... having high thermal conductivity
Implementation Method 2
high electrical resistivity and low thermal resistivity, reducing manufacturing costs and improving insulation
Data Source
AI summary
Provided is a semiconductor package having a power device and methods of fabricating the same. The semiconductor package includes a lead frame, a polymer layer component on the lead frame, a metal layer component on the polymer layer component, and a semiconductor chip on the metal layer component. The polymer layer component may include a material formed by adding alumina Al2O3, an aluminum nitride (AlN), or a boron nitride BN to an epoxy resin. The polymer layer component may have high thermal conductivity and good electric insulating characteristics.