Semiconductor Package Porous Heat Dissipation Structure
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Solution Overview
Problem
The challenge of effectively dissipating heat in semiconductor packages as integration density increases, leading to performance limitations and reliability issues due to insufficient heat management.
Innovation Solution
Incorporating a heat dissipation structure with a porous layer over semiconductor devices, featuring a substrate with trenches and a porous layer that increases surface area for enhanced heat dissipation, allowing cooling fluids to flow through and improve thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If integration density of semiconductor components is increased, then more components can be integrated into a given area, but heat dissipation becomes insufficient leading to performance limitations and reliability issues
Solution Approach 1:
The patent applies porous materials by forming a porous layer within the encapsulant that extends over the semiconductor device. This porous layer provides increased surface area for heat dissipation while maintaining structural integrity. The porous structure allows cooling fluids to penetrate and flow through, enhancing thermal management without compromising the sealed encapsulation.
Solution Approach 2:
The patent employs composite materials by combining the porous layer with the encapsulant material. The encapsulant serves dual functions: providing mechanical protection and sealing the semiconductor device, while the integrated porous layer provides thermal management functionality. This composite structure resolves the contradiction by integrating both protective and heat dissipation functions into a unified system.
2Temperature
If a heat dissipation structure with porous layer is added, then heat dissipation efficiency is improved, but device complexity increases
Solution Approach 1:
The patent merges the heat dissipation function with the existing encapsulant structure. Rather than adding a separate, complex heat dissipation system, the porous layer is integrated directly into the encapsulant material, allowing thermal management to be achieved through a unified structure that performs both protection and heat dissipation functions simultaneously.
Solution Approach 2:
The porous layer provides an efficient heat dissipation pathway without requiring complex external cooling systems. The porous structure naturally facilitates fluid penetration and heat transfer, achieving effective thermal management through a relatively simple additive structure that maintains overall device compactness.
3Temperature
If surface area is increased for heat dissipation, then heat transfer efficiency improves, but manufacturing complexity increases
Solution Approach 1:
The patent changes the physical parameters of the encapsulant material by introducing porosity. This parameter change transforms the solid encapsulant into a porous structure that provides increased surface area for heat dissipation. The porous layer can be formed through various manufacturing techniques such as infiltration or deposition, allowing control over pore size, distribution, and density to optimize heat transfer while maintaining manufacturability.
Solution Approach 2:
The porous layer provides increased surface area for heat dissipation through a relatively simple manufacturing approach. By forming the porous structure within the encapsulant during the encapsulation process, the patent avoids the need for separate, complex surface area enhancement steps, thereby maintaining ease of manufacture while achieving improved heat transfer efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances heat dissipation efficiency and capacity, improving the performance and reliability of semiconductor packages by increasing the surface area for better heat transfer.
Implementation Method 1
a porous layer for providing a high surface area for increasing heat dissipation efficiency
Implementation Method 2
allowing cooling fluids to flow through and improve thermal conductivity
Data Source
AI summary
In an embodiment, a package is provided. The package includes a semiconductor device; an encapsulant laterally surrounding the semiconductor device; and a heat dissipation structure disposed over the semiconductor device and the encapsulant, wherein the heat dissipation structure includes a plurality of pillars and a porous layer extending over sidewalls of the plurality of pillars.