Semiconductor Package Position Checkers for 3D Die Alignment
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Solution Overview
Problem
In three-dimensional semiconductor packaging, ensuring accurate positioning of stacked semiconductor dies is challenging, leading to potential defects and failures during the wire bonding process due to misalignment and incorrect separation distances.
Innovation Solution
Incorporating position checkers on the package substrate, such as first and second position checkers, which include reference and limit patterns to indicate allowable ranges for die placement, allowing for precise alignment and inspection of die positions to prevent misalignment and ensure proper separation distances.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If three-dimensional stacking of semiconductor dies is implemented to achieve high-speed operation and large-capacity data processing, then the functionality and performance of the semiconductor package are improved, but the difficulty of positioning and aligning the stacked dies increases, leading to potential defects and failures
Solution Approach 1:
Position checkers are disposed on the package substrate before the stacking process to pre-establish reference frameworks. These checkers include reference patterns that indicate precise positioning locations and allowable position ranges for each die, enabling accurate alignment during the stacking process and preventing positioning defects.
2Manufacturing precision
If position checkers with reference patterns and limit patterns are added to the package substrate to improve positioning accuracy, then the manufacturing precision is improved, but the device complexity increases due to additional structures
Solution Approach 1:
The position checkers serve multiple functions: they provide reference patterns for precise positioning, define allowable position ranges through limit patterns, and enable verification of proper die placement. By integrating these multiple functions into a single checker structure on the package substrate, the need for separate alignment marks and position indicators is eliminated, thereby managing complexity while maintaining high positioning accuracy.
Data Source
AI summary
A semiconductor package may include a first die disposed on a package substrate, a second die stacked on the first die, and a first position checker disposed on the package substrate. The first position checker may indicate a first position allowable range in which a first side of the first die can be located.