Semiconductor Package Conductive Antioxidant Layer for Post Reliability
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Solution Overview
Problem
The rapid miniaturization and multi-functionalization of electronic devices require highly integrated semiconductor chips with improved connection reliability, but existing fan out-type semiconductor packages face challenges in preventing interference between connection terminals and ensuring reliable electrical connections.
Innovation Solution
A semiconductor package design featuring a conductive antioxidant layer covering the side surfaces of conductive posts, which electrically connect the first and second distribution structures, preventing the formation of oxide layers and enhancing connection reliability by avoiding micro voids and delamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If connection structures are used to penetrate the encapsulant and electrically connect distribution structures, then electrical connection reliability is improved, but oxide layer formation on conductive posts causes micro voids and delamination that reduce connection reliability
Solution Approach 1:
A conductive antioxidant layer is introduced as an intermediary between the conductive post and the encapsulant. This intermediate layer prevents direct contact between the conductive post surface and the encapsulant material, thereby blocking oxide layer formation while maintaining electrical conductivity and mechanical integrity of the connection structure.
Solution Approach 2:
The patent converts the potentially harmful oxidation process into a beneficial protective mechanism by using the conductive antioxidant layer. This layer not only prevents harmful oxide formation but also provides enhanced corrosion resistance and maintains electrical conductivity, turning a reliability issue into a protective feature.
2Object-affected harmful factors
If fan out-type semiconductor package design is used to increase gap between connection terminals, then interference between connection terminals is prevented, but connection reliability must be maintained across the expanded structure
Solution Approach 1:
The connection structures are segmented with conductive antioxidant layers applied to specific portions (side surfaces of conductive posts). This segmentation allows the protective function to be applied precisely where needed at the interface between the connection structure and encapsulant, without affecting the overall fan-out layout or terminal spacing.
Solution Approach 2:
The conductive antioxidant layer provides localized protection at the critical interface between the conductive post and encapsulant. This local quality enhancement ensures that the most vulnerable areas (where oxidation would cause micro voids and delamination) are protected, while maintaining the overall fan-out package design benefits.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The use of a conductive antioxidant layer effectively prevents oxide layer formation on conductive posts, improving the reliability and durability of the semiconductor package by maintaining stable electrical connections and reducing the risk of delamination.
Implementation Method 1
a conductive antioxidant layer covering side surfaces of the conductive post
Data Source
AI summary
Provided is a semiconductor package including a first distribution structure, which includes a plurality of first distribution patterns disposed between a plurality of first lower surface connection pads and a plurality of first upper surface connection pads, and a first base insulating layer surrounding the plurality of first distribution patterns. The semiconductor package further includes a second distribution structure including a plurality of second distribution patterns disposed between a plurality of second lower surface connection pads and a plurality of second upper surface connection pads, and a second base insulating layer surrounding the plurality of second distribution patterns. The semiconductor package further includes a plurality of connection structures configured to penetrate the encapsulant and disposed adjacent to the semiconductor chip, wherein the connection structure includes a conductive antioxidant layer covering side surfaces of the conductive post.