Semiconductor Package Layout With Sub-Battery Power Buffering
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Solution Overview
Problem
Existing battery management systems struggle to provide continuous and stable power supply to complex electrical and electronic circuits, especially when dynamic power demands are required.
Innovation Solution
A semiconductor package design incorporating a power supply device, power management semiconductor chip, and a sub-battery connected through package substrates, where the sub-battery is charged by the power management chip to provide stable power to the semiconductor device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional battery management system is used, then the system can provide basic power supply, but it cannot ensure continuous and stable power supply when dynamic power demands are required
Solution Approach 1:
The power supply system is segmented into multiple independent power sources: a main power supply device (capacitor) and a sub-power supply device (sub-battery). Each power source can operate independently or in combination, allowing the system to meet varying power demands while maintaining stability. The semiconductor device is horizontally divided into multiple chips that can be selectively activated based on power requirements.
Solution Approach 2:
The power management semiconductor chip dynamically controls the switching between different power sources and the activation of semiconductor chips based on real-time power demands. The system can transition from using only the main power supply to combining main and sub-power supplies when higher or more sustained power is required, providing adaptability to dynamic power scenarios.
2Adaptability or versatility
If multiple semiconductor chips are integrated to meet dynamic power needs, then power requirements can be satisfied, but the device complexity increases
Solution Approach 1:
Multiple semiconductor chips are integrated into a single semiconductor device package, merging their functions while maintaining individual controllability. The power supply device and sub-battery are also combined into a unified power management system, reducing the number of separate components and simplifying the overall system architecture while still providing dynamic power capabilities.
Solution Approach 2:
The power management semiconductor chip serves multiple functions: it manages power from the main power supply, controls charging of the sub-battery, and regulates power distribution to multiple semiconductor chips. This multi-functional approach reduces the need for separate control components, thereby reducing device complexity while maintaining adaptability.
3Reliability
If a sub-battery is added to supplement power, then continuous power supply is improved, but the device complexity and manufacturing difficulty increase
Solution Approach 1:
The sub-battery is integrated within the semiconductor device package structure, nested alongside the semiconductor chips and power management chip. This nested arrangement allows the sub-battery to be manufactured and assembled as part of the overall device package, reducing manufacturing complexity compared to adding it as a separate external component.
Solution Approach 2:
The power management semiconductor chip acts as an intermediary that manages the interaction between the main power supply, sub-battery, and semiconductor chips. It handles charging control, power distribution, and coordination, simplifying the manufacturing process by providing a centralized control mechanism rather than requiring complex interconnections and control circuits between all components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design ensures continuous power supply to the semiconductor device, improving power stability and meeting dynamic power requirements by utilizing the sub-battery to supplement power from the main supply.
Implementation Method 1
a sub-battery electrically connected to the semiconductor chip through the second package substrate or directly connected to the semiconductor chip
Implementation Method 2
the first package substrate is configured to transfer power from the sub-battery to the semiconductor device
Data Source
AI summary
A semiconductor package may include a first package substrate; a power supply device electrically connected to a top surface of the first package substrate; a power management semiconductor chip electrically connected to the top surface of the first package substrate, wherein the power management semiconductor chip is horizontally apart from the power supply device; and a semiconductor device electrically connected to the top surface of the first package substrate, wherein the semiconductor device is horizontally apart from the power management semiconductor chip, wherein the semiconductor device includes: a second package substrate electrically connected to the top surface of the first package substrate; a semiconductor chip electrically connected to a top surface of the second package substrate; and a sub-battery electrically connected to the semiconductor chip through the second package substrate or directly connected to the semiconductor chip.