Semiconductor Package Layout for SoC-Memory Power Integration
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Solution Overview
Problem
Current semiconductor packaging technologies face challenges in integrating high-performance System on a Chip (SoC) structures with memory and additional components like silicon bridge dies, semiconductor capacitors, and voltage converters in a way that enhances performance, cost-effectiveness, and space utilization, while ensuring reliable electrical communication and power integrity.
Innovation Solution
A semiconductor package structure is designed with a redistribution structure that electrically connects SoC, memory, and additional components such as silicon bridge dies and voltage converters, using conductive materials and encapsulation layers to facilitate efficient integration and communication, and includes specific manufacturing processes like wafer-level packaging and hybrid bonding to optimize performance and reduce size and cost.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple components (SoC, memory, silicon bridge dies, voltage converters) are integrated in a single semiconductor package, then computational efficiency and power integrity are improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The semiconductor package is divided into multiple functional components including SoC structure, memory structure, silicon bridge dies, and voltage converters, each performing specific functions. This segmentation allows high computational efficiency through specialized processing while managing complexity through modular design and standardized interconnection interfaces.
Solution Approach 2:
The patent employs three-dimensional stacking architecture where components are arranged in vertical layers rather than traditional planar layouts. This dimensional transition enables higher integration density and improved power integrity through shorter interconnect paths, while complexity is managed through standardized vertical stacking processes.
2Productivity
If wafer-level packaging and hybrid bonding are used to integrate components, then integration speed and reliability are improved, but manufacturing precision requirements increase
Solution Approach 1:
Wafer-level packaging performs bonding and integration operations on entire wafers before dicing into individual chips. This preliminary action on the wafer level enables high-speed parallel processing of multiple devices simultaneously, while precision requirements are managed through standardized wafer handling and bonding processes.
Solution Approach 2:
Hybrid bonding technology serves as an intermediary mechanism that combines wire bonding and flip-chip bonding advantages. This intermediate approach provides both high integration speed through parallel connection establishment and adequate precision through standardized bonding parameters and interface designs.
3Volume of moving object
If components are closely integrated to reduce package size, then space utilization is improved, but thermal management and signal integrity challenges increase
Solution Approach 1:
The patent implements nested packaging where smaller components are positioned within or between larger structures. This nesting approach maximizes space utilization by efficiently packing components in three-dimensional space, while thermal management is addressed through strategically placed heat sinks and thermal vias within the nested architecture.
Solution Approach 2:
Silicon bridge dies serve as intermediary structures that provide both mechanical support and thermal pathways between closely integrated components. These intermediary elements facilitate heat dissipation while maintaining signal integrity through controlled impedance designs, enabling close integration without compromising thermal or electrical performance.
Data Source
AI summary
A semiconductor package structure is provided. The semiconductor package structure includes a first redistribution structure, a SoC structure, a memory structure, a first electronic component, and a first encapsulation layer. The first redistribution structure has a first side and a second side opposite to the first side. The SoC structure is on the first side of the first redistribution structure. The memory structure is adjacent to the SoC structure and on the first side of the first redistribution structure. The first electronic component is on the second side of the first redistribution structure and electrically connected to at least one of the SoC structure or the memory structure. The first encapsulation layer encapsulates the first electronic component. The first electronic component includes a semiconductor capacitor structure or a voltage converter.