Semiconductor Package With Integrated Wireless And Solar Power Modules
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Solution Overview
Problem
Conventional semiconductor packages face challenges in miniaturization due to the need for an independent power source, which is hindered by their high integration level and lack of self-powering capabilities.
Innovation Solution
Integration of a power source module within the package, comprising a first power supply module for wireless electromagnetic induction and a second power supply module for solar energy absorption, allowing the package to be self-powered and miniaturized.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If an independent power source is integrated into the package, then the package can be self-powered and achieve miniaturization, but the device complexity increases due to the need for multiple power supply modules and their integration
Solution Approach 1:
The patent combines multiple power supply modules (first power supply for electromagnetic induction and second power supply for solar energy) into a single integrated package structure. The power management unit coordinates both power sources, and the encapsulant integrates all components (chip, power supplies, connection members) into one unified device, eliminating the need for separate external power sources and reducing overall system volume.
Solution Approach 2:
The package is designed with multi-functional power supply capabilities, where the first power supply module receives power through electromagnetic induction for indoor use, and the second power supply module captures solar energy for outdoor use. The power management unit intelligently switches between these different power sources, making the package universally adaptable to various operating environments without requiring different device configurations.
2Ease of operation
If the package is miniaturized to eliminate external power sources, then portability improves, but the reliability of power supply may deteriorate due to the complexity of integrating multiple power modules
Solution Approach 1:
The patent changes the operational parameters of the power supply system by implementing dual power modes (electromagnetic induction for indoor, solar for outdoor) with automatic switching. The power management unit monitors the availability and status of each power source, dynamically adjusting which power supply is active based on environmental conditions, thereby maintaining reliable power delivery across different operating scenarios while keeping the device portable.
3Volume of moving object
If high integration level is achieved in the package, then the device becomes more compact, but the ease of manufacture deteriorates due to the complex integration of chip, power supplies, and connection members
Solution Approach 1:
The patent employs a nested structure where the first power supply module and second power supply module are positioned on opposite sides of the chip, with connection members penetrating through the encapsulant to establish electrical connections. The encapsulant itself serves as a housing that encapsulates and protects all internal components. This nested arrangement allows high integration within a compact volume while maintaining a systematic manufacturing approach where components can be sequentially assembled and connected.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the semiconductor package to be powered both wirelessly indoors and through solar energy outdoors, eliminating the need for an external power source and achieving miniaturization of the electronic system.
Implementation Method 1
a first power supply on the upper surface of the substrate, the first power supply configured to supply power from an external power source
Implementation Method 2
a self-powered power supply on the encapsulation member, the self-powered power supply configured to supply power to the semiconductor chip
Data Source
AI summary
A package integrated with a power source module may be provided. The package including a substrate having an upper surface and a lower surface, a chip on the upper surface of the substrate, a first power supply on the upper surface of the substrate, the first power supply at one side of the chip, an encapsulant encapsulating the chip and the first power supply, a second power supply on the encapsulant, the second power supply electrically connected with the substrate through a connection member, the connection member penetrating through the encapsulant may be provided.