Semiconductor Package Power Sensing via Shared Shunt Selector
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Solution Overview
Problem
Existing semiconductor packages face challenges in measuring consumed power of integrated circuits within a system-in-package (SiP) due to the enclosure of power wires, making it difficult to perform power measurement when the SoC is operating.
Innovation Solution
A semiconductor package design that includes a power management IC, shunt resistors mounted in series on power wires, and a selector to output voltage differences or amplified differences via output terminals, allowing power measurement within the SiP while minimizing circuit power consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If multiple shunt resistors are mounted in series on different power wires to measure power consumption of each semiconductor chip, then power measurement capability is improved, but device complexity increases
Solution Approach 1:
Multiple shunt resistors that were previously separate components are integrated into a single semiconductor chip. The chip includes multiple shunt resistors connected to respective power wires, allowing power measurement for multiple semiconductor chips through one unified component rather than multiple separate resistors.
Solution Approach 2:
The single semiconductor chip serves multiple functions: it acts as both the measurement device (containing shunt resistors for power measurement) and the controlled device (regulating power supply to multiple semiconductor chips). This multi-functional design reduces overall device complexity while maintaining measurement precision.
2Device complexity
If a single semiconductor chip contains multiple shunt resistors for power measurement, then device complexity is reduced, but manufacturing precision requirements increase
Solution Approach 1:
Multiple shunt resistors are fabricated and integrated within a single semiconductor chip structure. This merging of multiple measurement functions into one chip simplifies the overall device architecture while the chip fabrication process inherently handles the precision requirements through standard semiconductor manufacturing techniques.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate measurement of consumed power of the SoC and other semiconductor chips within the SiP, while reducing noise and power consumption of the measurement circuit.
Implementation Method 1
a plurality of shunt resistors 15a to 15n, each of which is mounted in series on a different one of power wires 11a to 11n connecting the PMIC 11 and the plurality of semiconductor chips 10, 12
Data Source
AI summary
A semiconductor package according to the present disclosure includes: a plurality of semiconductor chips that include a system on chip (SoC) in which a plurality of integrated circuits including a processor core and a microcomputer are integrated on a single chip; a power management integrated circuit (IC) for performing power management on the plurality of semiconductor chips; a plurality of shunt resistors each of which is mounted in series on a different one of power wires connecting the power management IC and the plurality of semiconductor chips; two output terminals; and a single selector that outputs voltages at both ends of a shunt resistor to an outside via the two output terminals, the shunt resistor being selected from among the plurality of shunt resistors. The power management IC, the plurality of semiconductor chips, the plurality of shunt resistors, and the single selector are mounted inside a single package.