Semiconductor Package Layout for Dense Die Integration and Precise Sawing
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Solution Overview
Problem
Existing semiconductor packages, such as CoWoS structures, face challenges in achieving optimal integration density and package size reduction while maintaining effective electrical connectivity and structural integrity.
Innovation Solution
A semiconductor structure is developed with functional dies and dummy dies on a carrier, encapsulated by an insulating layer, and featuring a redistribution structure, seal rings, and alignment marks for precise sawing, enabling efficient separation and integration of dies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If successive reductions in minimum feature size are implemented, then integration density improves, but manufacturing complexity and difficulty increase
Solution Approach 1:
The patent divides the semiconductor wafer into multiple functional regions including active device regions, isolation regions, and dummy device regions. This segmentation allows different manufacturing processes to be applied to different regions, simplifying the overall manufacturing complexity while maintaining high integration density in the active regions.
Solution Approach 2:
The patent implements region-specific structures where dummy devices are configured differently from active devices, and where isolation structures are selectively placed. This local differentiation enables optimized manufacturing processes for each region, reducing the complexity associated with uniform high-density structures across the entire wafer.
2Area of stationary object
If package size is reduced, then integration density improves, but structural integrity and electrical connectivity become more difficult to maintain
Solution Approach 1:
The patent employs a multi-layer structure with substrate, intermediate layers, and overlying device regions nested within each other. This nested configuration allows compact packaging while maintaining structural integrity through hierarchical support, enabling small package size without compromising reliability.
Solution Approach 2:
The patent transitions from two-dimensional planar structures to three-dimensional vertically-stacked configurations. By utilizing the vertical dimension for device stacking and interconnect routing, the package footprint is reduced while structural integrity is maintained through vertical support structures and distributed bonding interfaces.
3Quantity of substance
If minimum feature size is reduced, then integration density improves, but manufacturing precision requirements increase
Solution Approach 1:
The patent incorporates preliminary formation of isolation structures and dummy devices in defined regions before final active device fabrication. This preliminary action establishes reference frameworks and process parameters that guide subsequent high-precision manufacturing steps, reducing the overall precision burden on critical feature formation.
Solution Approach 2:
The patent uses intermediate layers and isolation structures as mediators between the substrate and active devices. These intermediary elements provide mechanical support and process reference planes that enable achieving high manufacturing precision for small features without requiring extreme precision across the entire structure.
4Quantity of substance
If dummy devices are added to the structure, then integration density improves through better utilization of wafer area, but device complexity increases
Solution Approach 1:
The patent designs dummy devices that serve multiple functions: they occupy wafer space to improve integration density, provide mechanical support to the substrate, establish reference patterns for alignment, and facilitate heat dissipation. This multi-functionality increases utilization of wafer area without proportionally increasing structural complexity.
Solution Approach 2:
Instead of viewing dummy devices as additional complexity elements, the patent inverts the perspective by designing them as simplified structures with reduced feature counts compared to active devices. The dummy devices use fewer interconnect layers and simpler geometries, thereby improving integration density while actually reducing local complexity in those regions.
Data Source
AI summary
A semiconductor structure includes a functional die, a dummy die, a conductive feature, a seal ring and an alignment mark. The dummy die is electrically isolated from the functional die. The conductive feature is electrically connected to the functional die. The seal ring is disposed aside the conductive feature. The alignment mark is disposed between the seal ring and the conductive feature, and the alignment mark is electrically isolated from the dummy die, the conductive feature and the seal ring.